A two-component addition type organic silicon heat-conducting adhesive and preparation method thereof

Abstract

The invention provides a two-component addition type silicone heat-conducting adhesive and a preparation method thereof. The addition-type silicone heat-conducting adhesive includes component A and component B, and component A includes the following parts by weight: 15-50 parts of vinyl silicone oil, 0.1-2 parts of anti-settling agent, 44-78 parts of modified silica powder 0.5-6 parts of auxiliary thermal conductive filler, 0.001-0.1 parts of platinum catalyst, component B includes the following parts by weight: vinyl silicone oil 12-35 parts, hydrogen-containing silicone oil 3-15 parts, anti-settling agent 0.1-2 parts , 44-78 parts of modified silica powder, 0.5-6 parts of auxiliary heat-conducting filler, and 0.001-0.1 part of inhibitor. The present invention adopts organosilane coupling agent containing non-reactive organic functional groups and hydroxyvinyl silicone oil to prepare structural modification regulator, and the silicon micropowder is modified by the prepared structural modification regulator, which improves the phase between silicon micropowder and organosilica gel. Capacitance, which solves the dispersion and stability of silicon micropowder in organic silica gel. While improving the thermal conductivity of organic silica gel, it reduces the density of thermal conductive adhesive, and prepares silicone thermal conductivity with high thermal conductivity, low density and good stability. glue.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and in particular relates to a heat-conducting glue and a preparation method thereof. Background technique [0002] With the advancement of science and technology and the rapid development of high-power electronic devices, more heat will inevitably be generated during the operation of the product. If the heat is not dissipated in time, it will reduce the efficacy of the product, shorten the service life of the product, and even possibly It will cause a safety accident. An effective way is to transfer the heat generated by the device through thermally conductive and insulating polymer materials. The simplest and most effective preparation method of thermally conductive and insulating polymer materials is to add thermally conductive and insulating fillers to the insulating polymer materials; the filled thermally conductive and insulating materials form effective net-like or chain-like st...

AI Technical Summary

Problems solved by technology

However, when this silane coupling agent modifies the microsilica powder, the main function is to improve the hydrophobicity of the microsilica powder surface and improve the interfacial compatibility between the microsilica powder and silicone oil, which has a poor effect on improving the stability of its system.

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