Surface-mounted piezoelectric micropump and manufacturing method thereof

Abstract

The invention discloses a surface-mounted piezoelectric micropump and a manufacturing method thereof. Firstly, five substrates are prepared, which are substrate one to substrate five in sequence from top to bottom; and the channels and cavities of the five substrates are prepared according to the structural characteristics of the micropump. Design and process according to this; substrate 1 constitutes the top cover, substrate 2-substrate 5 is stacked and bonded together to form the pump body; a metal seed layer is deposited on the inner wall of the metal through hole of the pump body, and then the corresponding metal is deposited by electroplating to fill the metal through hole. The hole forms a conductive channel; the required patterned metal layer is made on the bottom surface of the top cover, the top surface and the bottom surface of the pump body structure; then the piezoelectric vibrator, top electrode, and insulating layer are sequentially formed on the top surface of the pump body; finally, the top cover and the pump body are connected. The body can be welded together. The method is simple in processing, easy to implement, high in processing accuracy, and can be mass-produced at low cost. The prepared piezoelectric micropump has the characteristics of small size, light weight, integrated packaging and interface, large output flow rate, and is suitable for closed fluid circuits.

Description

technical field [0001] The invention relates to a piezoelectric micropump, and at the same time relates to a manufacturing method of a piezoelectric micropump, belonging to the technical fields of microelectromechanical systems, fluid drive, microsystem liquid cooling and heat dissipation, and biomedicine. Background technique [0002] In recent years, with the rapid development of microelectromechanical systems (MEMS) technology, piezoelectric micropumps have attracted widespread attention in thermal management, biomedical and other technical fields due to their unique advantages such as small size, low power consumption, and high output pressure. For example, in 2016, Luo Wenbo and others from the University of Electronic Science and Technology of China proposed a patent in the published invention patent (Chinese patent publication number is CN105977370, and the title of the invention is "an embedded refrigeration device based on a piezoelectric micropump and its preparatio...

AI Technical Summary

Problems solved by technology

[0003] However, there are some technical problems in piezoelectric micropumps at present: one is the interface problem. The fluid interface of piezoelectric micropumps generally realizes fluid in and out transfer through tubular structures, and most of the electrical interfaces that supply power to piezoelectric micropumps use "flying The piezoelectric micropump interface has the disadvantages of large volume and low integration; the second is that the piezoelectric vibrator as the driving component is placed on the outer surface of the piezoelectric micropump, and when there is a large pressure difference between the inside and outside of the fluid circuit, Piezoelectric micropumps will fail due to the inability of the piezoelectric vibrator to vibrate

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