Method for forming stacked structure bonded between inner layers by electrostatic force and method for manufacturing display device
A stacked structure and barrier technology, which is applied in the directions of final product manufacturing, sustainable manufacturing/processing, semiconductor/solid-state device manufacturing, etc., can solve problems such as damage to display elements and degradation of the uniformity of separation, so as to shorten manufacturing time and reduce Defects, effects of preventing chemical bonding
Inactive Publication Date: 2020-04-14
SAMSUNG DISPLAY CO LTD
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Problems solved by technology
However, when the carrier substrate is separated from the polymer substrate using a laser, the display element part may be damaged, and the uniformity of separation may deteriorate
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[0025] Hereinafter, a method for forming a stack structure bonded between inner layers by electrostatic force and a method for manufacturing a display device according to exemplary embodiments of the present invention will be described with reference to the accompanying drawings in which some exemplary embodiments are shown. method. The same or similar reference numerals may be used for the same or similar elements in the drawings.
[0026] It will be understood that when an element is referred to as being "on" another element, it can be directly on the other element or intervening elements may be present therebetween. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present.
[0027] It should be understood that although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers and / or sections, that these elements, components, regions, layers An...
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Abstract
A method for forming a stacked structure bonded between inner layers by electrostatic force is provided. According to the method, a first barrier flake charged with a first electric charge is adheredto a surface of a substrate. The first barrier flake is provided in plural. A second barrier flake is provided in a gap between adjacent first barrier flakes to form a first barrier layer charged withthe first electric charge. The second barrier flake has a size smaller than a size of the first barrier flake. A second barrier layer is formed on the first barrier layer. The second barrier layer ischarged with a second electric charge having a polarity opposite to the first electric charge to be combined with the first barrier layer by an electro-static force.
Description
technical field [0001] Exemplary embodiments relate to methods for manufacturing a display device. More particularly, the exemplary embodiments relate to a method for forming a stack structure bonded between inner layers by electrostatic force and a method for manufacturing a display device. Background technique [0002] Recently, in order to improve the portability and variability of the display device and to implement various designs, research and development on flexible display devices are being conducted. [0003] In order to obtain a flexible display device, a flexible polymer substrate can be used. For example, after the carrier substrate is combined with the polymer substrate, the display element portion may be formed on the polymer substrate. Thereafter, the carrier substrate can be separated from the polymer substrate to form a flexible display device. [0004] One of the known methods for separating the carrier substrate from the polymer substrate may use a lase...
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IPC IPC(8): H01L51/56H01L21/683
CPCH01L21/6836H01L2221/68386H01L2221/68345H10K71/80H10K71/441Y02E10/549Y02P70/50H10K77/111H10K59/126H10K2102/311H10K71/00
Inventor 高昇澈沈俊昊
Owner SAMSUNG DISPLAY CO LTD