A kind of deplating solution and deplating process for removing nickel layer on copper surface

Abstract

The invention discloses a stripping solution for removing a nickel layer on a copper surface, which is obtained by uniformly mixing the following raw materials in parts by weight: 15-35 parts of sodium bromide, 6-10 parts of oxidizing agent, 5-10 parts of tartaric acid, urea 0.5-1 part, 0.2-0.5 part of benzotriazole, 0.1-0.3 part of cobalt acetate, and 40-60 parts of water; the oxidizing agent is 30wt% hydrogen peroxide aqueous solution, manganese dioxide, and sodium perbromate according to the mass ratio 10~20:3~5:1 mixture. The deplating solution of the invention has high deplating efficiency for the nickel layer and does not cause corrosion to the copper substrate, and has important practical application value.

Description

technical field [0001] The invention belongs to the field of metal surface treatment, and in particular relates to a deplating solution for removing a nickel layer on a copper surface and a deplating process thereof. Background technique [0002] In the modern electroplating process, it is often necessary to plate a nickel layer on the copper layer, so as to play the role of anti-corrosion, anti-rust and transitional coating of other metals. However, the electroplating process often has many processes, the untimely maintenance of the plating solution or the change of the electroplating process parameters directly lead to frequent quality problems of the nickel layer during the nickel plating process of the copper layer, and it is necessary to strip and re-plate nickel. However, existing stripping solutions often also strip or over-corrode the copper layer, resulting in scrapped products. Existing techniques for stripping nickel on the copper layer mainly include electrolysi...

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Problems solved by technology

[0004] In order to overcome the deficiencies in the prior art, the purpose of the present invention is to provide a kind of deplating solution that does not cause corrosion to the copper substrate and has high deplating efficiency to the nickel layer, mainly to solve the problem that the deplating solution has a slight effect on the copper layer in the prior art. Problems of low corrosion and deplating efficiency

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