A kind of halogen-free resin composition, flexible printed circuit reinforcing plate containing it and application thereof
A resin composition and printed circuit technology, applied in the field of flexible printed circuit reinforcement boards and halogen-free resin compositions, can solve the problems of unsuitable touch stickiness, achieve excellent storage stability, and meet processing and application requirements. Effect
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Embodiment 1
[0058] A halogen-free resin composition, comprising the following components in parts by weight: 50 parts by weight of polyacrylate SG-P3, 10 parts by weight of epoxidized polybutadiene L680, 15 parts by weight of copolyamide M1276F, 5 parts by weight of dicyandiamide Amine, 10 parts by weight of flame retardant SPB-100.
[0059] The halogen-free resin composition is used for the preparation of a reinforcing board for a flexible printed circuit, and the specific method is as follows:
[0060] (1) Mix the halogen-free resin composition with methyl ethyl ketone, and disperse it uniformly by using a ball mill to obtain a uniformly dispersed resin glue with a solid content of 40%;
[0061] (2) Use a coating machine to coat the resin glue solution obtained in step (1) on the surface of a polyimide composite film with a thickness of 50 μm, and the coating thickness is 25 μm; place it at 85° C. and dry for 3 minutes to make the polyimide A partially cured resin layer is formed on th...
Embodiment 2
[0063] A halogen-free resin composition, comprising the following components in parts by weight: 55 parts by weight of polyacrylate SG-708-6, 15 parts by weight of epoxidized polybutadiene L681, 18 parts by weight of copolyamide M995F, 8 parts by weight 4,4'-diaminodiphenyl sulfone and 15 parts by weight of flame retardant OP-935.
[0064] The halogen-free resin composition is used for the preparation of a reinforcing board for a flexible printed circuit, and the specific method is as follows:
[0065] (1) Mix the halogen-free resin composition with toluene, and disperse it uniformly by using a pot mill to obtain a uniformly dispersed resin glue solution with a solid content of 50%;
[0066] (2) Use a coating machine to coat the resin glue solution obtained in step (1) on the surface of a polyimide composite film with a thickness of 75 μm, and the coating thickness is 50 μm; place it at 130° C. and dry for 5 minutes to make the polyimide A partially cured resin layer is forme...
Embodiment 3
[0068]A halogen-free resin composition, comprising the following components in parts by weight: 60 parts by weight of polyacrylate PMS-12-81, 20 parts by weight of epoxidized polybutadiene L682, 25 parts by weight of copolyamide M995F, 10 parts by weight of Diphenylmethanediamine, 20 parts by weight of flame retardant OP-930.
[0069] The halogen-free resin composition is used for the preparation of a reinforcing board for a flexible printed circuit, and the specific method is as follows:
[0070] (1) Mix the halogen-free resin composition with cyclohexanone, and use a sand mill to disperse it evenly to obtain a uniformly dispersed resin glue with a solid content of 60%;
[0071] (2) Use a coating machine to coat the resin glue solution obtained in step (1) on the surface of a polyimide composite film with a thickness of 200 μm, and the coating thickness is 25 μm; place it at 160° C. for 8 minutes to make the polyimide A partially cured resin layer is formed on the surface of...
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Abstract
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