Transfer printing process method for flexible MEMS device

Abstract

The invention belongs to the technical field of semiconductor / MEMS manufacturing processes, provides a transfer printing process method for a flexible MEMS device, and particularly can be used for transferring a structure or device manufactured on a rigid substrate such as silicon onto a flexible substrate such as polyimide, PET and PDMS. In a case of a PZT-based flexible piezoelectric energy collector, aiming at the problem that the success rate of the whole process is affected due to low success rate of the process, the invention innovatively proposes the use of SiNX deposited by PECVD as asacrificial layer released before transfer printing. Compared with a sacrificial layer taking SiO2 as a release process in a traditional process, the improvement obviously shortens the release time, so that the structure is prevented from losing efficacy due to long-time soaking in an HF acid buffer solution, and the success rate of a transfer printing process is greatly improved. And meanwhile, the process improvement of pressurizing and heating in the transfer printing period is provided, and the transfer printing success rate is further increased.

Description

technical field [0001] The invention belongs to the technical field of semiconductor / MEMS manufacturing technology, and is a process method for improving the success rate of multi-layer microstructure transfer printing by improving sacrificial layers and process conditions, and is applicable to the transfer printing process flow of flexible MEMS devices. Background technique [0002] Extensible flexible MEMS electronic devices combine inorganic electronic materials with flexible substrates, which not only maintains the superior electrical properties of inorganic electronic materials, but also has good ductility. It has a wide range of applications in the fields of display, energy, medical health, and human-computer interaction. Application prospects. However, inorganic electronic materials cannot be directly grown and processed on flexible substrates. To solve this problem, researchers have developed transfer printing technology, which peels inorganic thin films from their g...

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Problems solved by technology

[0004] The thermal release tape transfer method has high requirements on the precise grasp of the transfer temperature and time; the water-soluble tape will decompose when it meets water, but a small amount of residue remains on the surface of the structure, polluting the structure; PDMS is the most widely used in the flexible transfer process stamp material, the process is the most feasible, but the traditional transfer process often uses SiO 2 In order to release the sacrificial layer of the process, it was found in many experiments that SiO 2 When used as a sacrificial layer, the release time is too long, causing the device structure to fail due to too long soaking time in HF acid buffer, and the adhesion between the device and the flexible acceptor substrate is too weak during the printing process

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