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Negative expansion filler and preparation method and application thereof

A negative expansion material and negative expansion technology, applied in the field of organic electroluminescence, can solve the problems of disengagement, difficult to release stress, increase the risk of cracking, etc., and achieve the effect of preventing cracking

Active Publication Date: 2020-05-01
XIAMEN TIANMA MICRO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] (1) The current packaging technology is to use Frit to realize the bonding of glass substrates and thin-film transistor (TFT) substrates; Frit materials are usually materials that can act as fluxes: self-fluxing elements generally include B and Si, and the higher the content, The higher the hardness, the more serious the cracking tendency, although Si and its oxides can provide sufficient hardness for Frit materials, but there is a greater risk of cracking
[0005] (2) Frit packaging requires high-temperature laser melting. Due to the rapid heating and cooling during laser cladding, it is bound by the surrounding colder substrate during the subsequent solid-state cooling and shrinkage process. These stresses are often difficult to release, and once released Will cause cracks and detachment
[0006] (3) Usually, the cracks in a single laser cladding are mostly perpendicular to the laser scanning direction, and the cracks are distributed in parallel. In multiple overlapping laser cladding, due to the mutual superposition of residual stress, the cladding layer is more sensitive to cracking, and the cladding layer is more sensitive to cracking. The cracks on the surface are distributed in a network shape, and there are also cases where the main crack has branch cracks, which further increases the risk of cracking

Method used

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  • Negative expansion filler and preparation method and application thereof
  • Negative expansion filler and preparation method and application thereof
  • Negative expansion filler and preparation method and application thereof

Examples

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preparation example Construction

[0037] The second object of the present invention is to provide a method for preparing the negative expansion filler described in the first object, the preparation method comprising: mixing negative expansion materials and sintering to obtain the negative expansion filler;

[0038] The negative expansion material includes at least two white pomegranate series negative expansion materials, or at least two perovskite series negative expansion materials, or at least one white pomegranate series negative expansion material and at least one perovskite series negative expansion material combination of materials.

[0039] In a specific embodiment, the preparation method comprises the steps of:

[0040] (1) Mix the negative expansion materials, grind for the first time, sieve, and grind for the second time to obtain a premix;

[0041] (2) Dry the premix, perform the first sintering and the second sintering in sequence, and cool to obtain the negative expansion filler.

[0042] In th...

Embodiment 1

[0069] This example provides a white pomegranate series composite negative expansion filler, the preparation method of which is as follows:

[0070] (1) NaZr with a mass ratio of 0.5:1 2 P 3 o 12 and NaTi 2 P 3 o 12 Mix, grind for the first time in a ceramic crucible, sieve, and grind for the second time in an agate crucible with absolute ethanol as a medium until the particle size distribution is: D 75 50 25 <1.5μm, get the premix;

[0071] (2) Dry the premix at 110°C for 10h, sinter the first time at 800°C for 1h, and sinter the second time at 1100°C for 3h, then cool to obtain the negative expansion filler Na 1-x Zr 2 P 3-x Si x o 12 , and x is 0.

Embodiment 2

[0073] The difference with Example 1 is that the raw material is NaZr with a mass ratio of 1:1 2 P 3 o 12 and NaTi 2 P 3 o 12 , to get the negative expansion filler Na 1-x Zr 2 P 3-x Si x o 12 , and x is 0.25.

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Abstract

The invention relates to a negative expansion filler and a preparation method and application thereof. The negative expansion filler is prepared from a negative expansion material, the negative expansion material comprises at least two white pomegranate series negative expansion materials, or at least two perovskite series negative expansion materials, or a combination of at least one white pomegranate series negative expansion material and at least one perovskite series negative expansion material. The negative expansion filler provided by the invention has the advantages that the temperaturerises, generates positive expansion in the c-axis direction, generates negative thermal expansion (shrinkage phenomenon) in the a / b-axis direction, inhibits overall expansion cracking, and can adjustthe thermal expansion coefficient of the Frit material by adjusting the variety and proportion of the negative expansion filler, so that the thermal expansion coefficient of the Frit material is matched with the thermal expansion coefficient of a glass substrate, and cracking caused by stress is prevented.

Description

technical field [0001] The invention relates to the technical field of organic electroluminescence, in particular to a negative expansion filler and a preparation method and application thereof. Background technique [0002] With market demands, organic light emitting diode (OLED) display screens will become a major trend in the future, and active matrix organic light emitting diodes or active matrix organic light emitting diode packaging (Frit packaging) will become the current packaging method. There are organic layer materials that are extremely sensitive to water vapor and oxygen in OLED devices, which greatly reduces the lifespan of OLED display devices. In order to solve this problem, in the prior art, various materials are mainly used to isolate the organic layer material of the OLED from the outside world. [0003] The main sealing method in the prior art is Frit packaging (hermetic sealing glass frit composition), filling the sealing area of ​​the upper and lower s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03C8/24C01B33/20
CPCC03C8/24C01B33/20
Inventor 李丹丹
Owner XIAMEN TIANMA MICRO ELECTRONICS