Preparation method of alloy electroplating material with high bonding force

An alloy electroplating and bonding force technology, applied in electrolytic coatings, surface reaction electrolytic coatings, coatings, etc., can solve problems such as unfavorable electroplating process, no open etching method, non-uniform corrosion, etc. Good detoxification and high solubility
CN111118557AActive Publication Date: 2020-05-08东莞市原琦五金有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
东莞市原琦五金有限公司
Publication Date
2020-05-08

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Abstract

The invention provides a preparation method of an alloy electroplating material with the high bonding force. According to the preparation method, a shielding layer at the bottom of an anodic oxidationfilm is removed, an aluminum metal base material is exposed, then a zinc transition layer and a zinc-nickel electroplating layer are sequentially electroplated, and the bonding force of the base material and the plating layer is finally effectively improved.
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Description

technical field

[0001] The invention relates to a method for preparing a high-binding force coating using anodized aluminum as a base material, which belongs to the field of electrochemically preparing anodized aluminum materials without shielding layers, and is especially suitable for improving the bonding force between aluminum materials and electroplated metals.

[0002] technical background

[0003] With the rapid development of science and technology and industry, people have more and more stringent requirements on metal properties. Lightweight and high-hardness metal alloy materials are widely used in related fields. Since the output of aluminum in the world is second only to iron, light metal aluminum alloys The material gets a lot of attention. Aluminum and aluminum alloy materials have low hardness, poor wear resistance, and are prone to intergranular corrosion, and a thin oxide film is easy to form on the surface of aluminum under natural conditions, and the film is...

Claims

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