Gallium nitride power module packaging method, pressurizing device and pre-curing molding rubber ring

A power module and packaging method technology, which is applied in the direction of electric solid-state devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve the problems of poor packaging quality and low yield rate, and achieve good packaging quality and high packaging quality. High, high-quality appearance

Active Publication Date: 2020-05-12
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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  • Abstract
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  • Claims
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Problems solved by technology

[0004] The purpose of the present invention is to provide a gallium nitride power module packaging method, a pressurizing device and a pre-cured molding rubber ring, aiming to solve the problems of poor packaging quality and low yield of gallium nitride power modules in the prior art

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  • Gallium nitride power module packaging method, pressurizing device and pre-curing molding rubber ring
  • Gallium nitride power module packaging method, pressurizing device and pre-curing molding rubber ring
  • Gallium nitride power module packaging method, pressurizing device and pre-curing molding rubber ring

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Embodiment Construction

[0041] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0042] Please also refer to Figure 1 to Figure 4 , Image 6 and Figure 7 , the gallium nitride power module packaging method provided by the present invention will now be described. The gallium nitride power module packaging method includes the following steps:

[0043] Step S101, printing the sealant into the cavity 80 of the molding mold 8, keeping the mold 8 printed with the sealant in a horizontal state and putting it into a vacuum oven at 60°C to 90°C for 15min to 20min to obtain a pre-cured molding glue Ring 6;

[0044] Step S102, mounting the pre-cure...

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Abstract

The invention provides a gallium nitride power module packaging method, a pressurizing device and a pre-curing molding rubber ring, and belongs to the technical field of power module packaging. The packaging method comprises the following steps of: printing a sealant into a cavity of a forming mold, putting the forming mold printed with the sealant into a vacuum oven at the temperature of between60 and 90 DEG C in a horizontal state, and performing baking for 15 to 20 minutes to obtain a pre-cured forming rubber ring; mounting the pre-cured molded rubber ring on the packaging tube shell on which the gallium nitride power module is placed, and aligning and mounting a packaging tube cap and the packaging tube shell on which the pre-cured molded rubber ring is mounted; placing the packagingtube shell pasted with the packaging tube cap in a pressurizing device, applying downward pressure to the top surface of the packaging tube cap, and maintaining the pressure; and putting the pressurizing device applying the preset pressure to the packaging tube cap into a vacuum oven at the temperature of 120-170 DEG C to bake for 3-5 hours, so that the pre-cured molded rubber ring is re-cured toobtain the packaged gallium nitride power module.

Description

technical field [0001] The invention belongs to the technical field of power module packaging, and more specifically relates to a gallium nitride power module packaging method, a pressurizing device and a pre-cured molding rubber ring. Background technique [0002] The GaN (Gallium nitride, gallium nitride) power module uses heat sink copper-molybdenum-copper-copper material as the base, Kovar alloy as the lead frame, and uses aluminum oxide ceramic caps for packaging by bonding. The inside of the module is sealed after the chip is sintered or bonded, and the gold wire is bound. [0003] At present, the packaging method of GaN power modules is as follows: After applying sealant around the dam of the tube shell, aligning the tube cap with the tube shell and mounting them, continuously applying a certain pressure, and baking in an oven. The problem with this current method of operation is that the amount of sealant applied to the side wall of the shell is not uniform. The am...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/52H01L23/10H01L21/67
CPCH01L21/52H01L21/67121H01L23/10
Inventor 魏少伟袁彪常青松宋银矿汲琳张磊连智富于亮马鹏王净刘爱平张培庆
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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