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Treatment head, treatment system and method for treating a local surface area of a substrate

A surface area, processing head technology, applied in the field of processing head, can solve the problems of poor imprint quality, reduced output, low yield rate, etc.

Active Publication Date: 2020-05-12
SUSS MICROTEC PHOTOMASK EQUIP GMBH & CO KG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Also, if the stencil has any form of defects such as resist residues, stains, particles, surface scratches, chipping, bumps, etc., it may result in poor imprint quality, low yield, and reduced throughput

Method used

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  • Treatment head, treatment system and method for treating a local surface area of a substrate
  • Treatment head, treatment system and method for treating a local surface area of a substrate
  • Treatment head, treatment system and method for treating a local surface area of a substrate

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Embodiment Construction

[0037] For the purposes of illustration, embodiments of the present invention will be described as being applied to cleaning a template for micro shadows, and in particular, a table area for nano-embedded micro shadows is cleaned, although obvious obvious YES, embodiments of the present invention can also be applied to cleaning different substrates or other plasma treatments for the surface of the substrate, such as surface passivation or partially using plasma to change the surface properties. The surface area of ​​the template for nano-imprint miniane is a region directly in contact with the resist, and the resist particles may adhere to this area, which may damage the function of the template. Such resist particles are considered contaminants, and the contaminants should be removed during the cleaning process without damaging fine structures of the surface area.

[0038] The directional phrase used herein is the orientation of the components shown in the scheme, such as, left, ...

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Abstract

A treatment head for treating a surface area of a substrate includes a housing having a main surface configured to be arranged adjacent to and facing the surface area of the substrate to be treated. An exhaust opening in the main surface of the housing is connectable to an exhaust device via an exhaust gas path formed at least in part in the housing. A radiative heater is arranged in the housing to emit heat radiation through a radiation opening in the main surface. A plasma source is arranged in the housing to emit a plasma jet through a plasma exit opening in the main surface. An outlet opening in the main surface of the housing is connectable to a gas source via an gas path formed at least in part in the housing. The centers of the exhaust opening, the radiation opening, the plasma exitopening, and the outlet opening are arranged in the above order along a first direction of the main surface.

Description

Technical field [0001] The present invention relates to a process head, a processing system, and a method of treating a partial surface region of a substrate using plasma. The present invention refers to a preferred treatment from the substrate removal of contaminants. [0002] The processing head, the processing system, and the processing method are particularly applicable to the templates used in the nano-embedded micro shadow, but can also be used in other techniques that need to be plasma processing in a controlled environment. Background technique [0003] Nano-imprint miniane is a technique for the use of patterned templates to make nano-grade embossed patterns, in which patterning templates are also referred to as shielding or molds. The template is used to imprint the pattern to a suitable material, which is, for example, a liquid resist. The material can then be cured while the material is still in contact with the template, and the template is removed after curing. When...

Claims

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Application Information

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IPC IPC(8): G03F7/20H01L21/02B05B1/04
CPCG03F7/0002B08B15/04H05H1/24H05H2245/40G03F7/70925B08B5/023B08B7/0071H01J37/00H05H1/46B08B2205/005B08B7/00G03F1/82
Inventor 伍威·戴兹马丁·萨玛约亚
Owner SUSS MICROTEC PHOTOMASK EQUIP GMBH & CO KG
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