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Special tin surface protective agent for precision circuit board line manufacturing, and production method thereof

A circuit board circuit and production method technology, applied in coatings, anti-corrosion coatings, polyether coatings, etc., can solve problems such as full contact and mixing of difficult raw materials, difficulty in mixing, and difficulty in preventing surface corrosion of circuit boards

Pending Publication Date: 2020-05-19
SHENZHEN RONGWEIYE ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide the special tin surface protectant and production method thereof for precision circuit board circuit, to solve the problems in the special tin surface protectant for circuit board circuit when using the existing circuit board circuit special tin surface protectant and its production method. It is difficult for some raw materials to be fully mixed without high-frequency vibration, and without preliminary puffing treatment, it is difficult for the raw materials to fully contact and mix with the next-step raw materials, and the special tin surface protector for circuit boards is not added with anti-aging preparations, so it is difficult to prevent the circuit board from being damaged after long-term use. The problem of surface corrosion

Method used

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Embodiment Construction

[0022] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0023] The invention provides the following technical proposal: special tin surface protective agent for precision circuit board circuit production, which is characterized in that it includes the following parts by weight: surfactant 10%-12%, organic solvent ethyl acetate 25%-45%, organic solvent Add 8% to 15% of nano silicon dioxide, 10% to 12% of sodium lauryl sulfate, 4% to 10% of stabilizer, 10% to 14% of sodium hypophosphite, octylphenol polyoxyethylene ether 8%-12%, res...

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PUM

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Abstract

The invention discloses a special tin surface protective agent for precision circuit board line manufacturing, and a production method thereof. The preparation method comprises the following steps: taking an organic solvent ethyl acetate, adding nano silicon dioxide, lauryl sodium sulfate, a stabilizer, sodium hypophosphite and octylphenol polyoxyethylene ether into the organic solvent, and fullymixing to obtain a material A; heating a resin, an anti-aging agent, a drier and benzotriazole to 300 DEG C through burdening, and fully mixing to obtain a material B; feeding the material A into a high-frequency furnace, and carrying out high-frequency oscillation, wherein the temperature is controlled to be 180-220 DEG C; controlling the time based on the raw materials, discharging after preliminary puffing to obtain a material C; and adding the material B into the material C, and fully mixing. In the prior art, part of raw materials in a special tin surface protective agent for a circuit board line are difficult to fully mix without high-frequency oscillation and are difficult to fully contact and mix with the next raw material without primary puffing treatment, so that the production efficiency of the production method of the special tin surface protective agent for the circuit board line is influenced. The method of the invention avoids the problems in the prior art.

Description

technical field [0001] The invention belongs to the technical field of special tin surface protectant for circuit board circuits, and in particular relates to a special tin surface protectant for precision circuit board circuit production and a production method thereof. Background technique [0002] The names of the circuit boards are: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin Thin circuit boards, printed (copper etching technology) circuit boards, etc. The circuit board makes the circuit miniaturized and intuitive, and plays an important role in mass production of fixed circuits and optimizing the layout of electrical appliances. Circuit boards may be referred to as printed wiring boards or printed circuit boards. [0003] The purpose of the present invention is to provide a ...

Claims

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Application Information

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IPC IPC(8): C09D171/02C09D5/08C09D7/61C09D7/63
CPCC08K2201/011C09D5/08C09D171/02C09D7/61C09D7/63C08K13/02C08K3/36C08K5/3475
Inventor 丁启恒
Owner SHENZHEN RONGWEIYE ELECTRONICS
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