Heat dissipation type single/double-fiber pluggable optical module, and assembling method and outer clamping fastener thereof

[0062] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments for understanding the inventive concept of the present invention, and cannot represent All the embodiments are not explained as the only embodiment. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art under the premise of understanding the inventive concept of the present invention fall within the protection scope of the present invention.

[0063] It should be noted that if there is a directional indication (such as up, down, left, right, front, back...) in the embodiment of the present invention, the directional indication is only used to explain that it is in a specific posture (as shown in the drawings). If the specific posture changes, the relative positional relationship, movement, etc. of the components below will also change the directional indication accordingly.

[0064] In order to understand the technical solution of the present invention more conveniently, the heat-dissipating single/dual fiber pluggable optical module and its assembly method and external clip fasteners of the present invention will be described and explained in further detail below, but they are not limited to the present invention. protected range.

[0065] figure 1 A three-dimensional schematic diagram of a heat-dissipating single/dual fiber pluggable optical module with the cover facing upward; figure 2 The three-dimensional schematic diagram of the heat-dissipating single/dual fiber pluggable optical module with the base facing upward; image 3 An exploded schematic diagram of the heat-dissipating single/dual fiber pluggable optical module is shown. Reference Figure 1 to Figure 3 , The first specific embodiment of the present invention discloses a heat-dissipating single/dual fiber pluggable optical module, including: a housing cover 10, a module circuit board 20, a base 30, and an outer clamp 40. Figure 4 A three-dimensional schematic diagram of the outer clip fastener 40 with the clip opening facing upward; Figure 5 A three-dimensional schematic diagram of the housing cover 10 with the device containing groove 11 facing upward is shown; Image 6 A three-dimensional schematic diagram of the base 30 is drawn, (A) is the inner face up, (B) is the bottom face up; Figure 7 The cross-sectional schematic diagram of the heat-dissipating single/dual fiber pluggable optical module from the optical fiber interface 12 to the plug port 13 is shown.

[0066] Reference Figure 5 , The inside of the shell cover 10 is formed as a long strip device containing groove 11 (such as Figure 5 , Figure 7 (Shown), one end of the device accommodating groove 11 is an optical fiber interface 12, and the other end is a plug-in port 13. The device accommodating groove 11 is provided with a first positioning concave ring 14 (such as Figure 5 (Shown), there is a limit gap 15 adjacent to the plug-in port 13, and a heat-conducting boss 16 is formed in the device containing groove 11. The number and positions of the thermally conductive bosses 16 can correspond to the chip heating elements 26 provided on the module circuit board 20. The optical fiber interface 12 is a connector for splicing optical fibers or other high-speed data transmission lines, the plug-in port 13 is for plugging into a communication device such as a switch, and the thermal conductivity of the thermally conductive boss 16 is specifically not lower than that of the shell. The thermal conductivity of the main body of the cover 10 is preferably an extension block where the thermally conductive boss 16 is integrally formed by the cover 10. The setting function of the cover 10 includes but is not limited to: positioning of the module circuit board 20 during assembly and in the product, the upper half of the side of the module circuit board 20 in the product, and the positioning of the module circuit board. 20 The first heat conducting carrier of the heating element.

[0067] Reference image 3 versus Figure 7 , The module circuit board 20 is installed in the device accommodating groove 11, the module circuit board 20 is electrically connected to the single/dual fiber optical transceiver assembly 50, and the module circuit board 20 is provided with a chip heating body 26, The single/dual fiber optical transceiver assembly 50 has a positioning ring 54, a side edge of the module circuit board 20 has a board limiting portion 25, and the module circuit board 20 is limited to the limiting portion 25 via the board limiting portion 25 The notch 15 is the chip heating body 26 corresponding to the thermal coupling position of the thermally conductive boss 16. In a specific example, the module circuit board 20 is a small-size multilayer printed circuit board, but without limitation, it may also be a packaged module, a ceramic circuit board or other strip-shaped circuit structures. One of the functions of the module circuit board 20 is to integrate the active devices in the module. The single/dual fiber optical transceiving assembly 50 may be a single fiber optical transceiving assembly having both light receiving and light emitting, or a dual fiber structure, including an optical receiver and an optical transmitter. The electrical connection between the single/dual fiber optical transceiver assembly 50 and the module circuit board 20 may be a flexible board connection or a lead connection. The preferred specific mode of electrical connection is mainly to realize a retractable electrical connection between the single/dual fiber optical transceiver assembly 50 and the module circuit board 20. The thermal coupling manner of the thermally conductive boss 16 and the chip heater 26 can utilize a low-viscosity thermally conductive paste, an adhesive high thermally conductive metal colloid or/and a metal gasket. In this example, the positioning ring 54 is a circular concave ring structure, and the first positioning concave ring 14 is a semicircular convex ring structure extending from a concave arc.

[0068] Reference Image 6 The base 30 is combined with the housing cover 10, the base 30 is provided with a second positioning concave ring 34 facing the optical fiber interface 12, and the single/dual fiber optical transceiver assembly 50 passes through the positioning ring 54 Fixed to the first positioning concave ring 14 and the second positioning concave ring 34, and the side edge of the module circuit board 20 is clamped and fixed between the cover 10 and the base 30, the module The circuit board 20 and the cover 10 form a first heat convection channel 61 (such as Figure 7 As shown), a second heat convection channel 62 is formed between the module circuit board 20 and the base 30 (such as Figure 7 (Shown), the first heat convection passage 61 and the second heat convection passage 62 are both connected to the plug port 13. The setting function of the base 30 includes but is not limited to: the lower half of the side of the module circuit board 20 is clamped in the product, and the third heat conducting carrier for the heating element on the module circuit board 20. In this example, the second positioning concave ring 34 is a semicircular convex ring structure extending from a concave arc. In this example, the first thermal convection channel 61 and the second thermal convection channel 62 also form a communication relationship at the optical fiber interface 12.

[0069] Reference Figure 4 , The outer clip fastener 40 is disposed at the outer peripheral portion of the housing cover 10 corresponding to the first positioning concave ring 14, and the outer clip fastener 40 has a middle fitting part 41, which is formed by the middle fitting part. 41 The side clip attaching portion 42 bent and extended on both sides and the buckling portion 43 bent and extended by the side clip attaching portion 42. The middle attaching portion 41 and the side clip attaching portion 42 are thermally attached to each other In the case cover 10, the buckling portion 43 is thermally buckled to the base 30 to establish a thermal conduction path from the thermally conductive boss 16 to the base 30 via the outer clamp 40. The setting function of the base 30 includes but is not limited to: stabilizing the clamping of the cover 10 and the base 30 in the product, enhancing the heat conduction from the cover 10 to the base 30, and sharing the thermal stress of the locking point 70 .

[0070] The implementation principle of this embodiment is: using the side edges of the module circuit board 20 to be clamped and fixed between the housing cover 10 and the base 30 to form a connection between the upper and lower portions of the module circuit board 20 and the The two thermal convection channels of the plug-in port 13 are used, and the thermally conductive boss 16 in the cover 10 and the outer clip 40 with a specific structure are used to thermally couple the thermally conductive boss 16 The chip heating element 26, the middle attaching portion 41 and the side clip attaching portion 42 are thermally attached to the cover 10, and the buckling portion 43 is thermally buckled to the base 30 to establish the The heat conduction boss 16 passes through the outer clamp 40 to the heat conduction path of the base 30, thereby forming two heat convection channels in the single/dual fiber pluggable optical module and the chip surrounding the two heat convection channels The upper part passes through the heat-conducting boss 16, the main body of the cover 10 passes through the bad heat conduction path from the outer clamp 40 to the base 30, which improves the air-cooled heat dissipation of single/dual fiber pluggable optical module products Efficiency, suitable for high-speed communication data transmission. In a specific application, the heat-dissipating single/dual fiber pluggable optical module is a BIDI SFP+ optical module with a transmission rate of 10G/s or higher.

[0071] Regarding the chip heating body 26 and its thermal coupling form using the heat conduction boss 16, in a preferred example, the chip heating body 26 includes an optical signal receiving/transmitting drive chip assembly and a drive control chip assembly At least two of the information storage chip components, the heat conducting boss 16 is multiple and the area is slightly larger than the chip heating body 26. The information storage chip assembly is used to store data required by the drive control chip assembly, such as temperature data or adjustment parameters; the drive control chip assembly is used to control the operation of the optical signal receiving/transmitting drive chip assembly; The optical signal receiving/transmitting drive chip component is used to drive the single/dual fiber optical transceiver component 50 to emit or receive laser signals. Therefore, by using the plurality of heat conducting bosses 16 with a slightly larger area, the chip heating body 26 can be connected to the chip heating body 26 effectively without closing the first heat convection channel 61. Generally, the chip components are in various suitable semiconductor packaging forms, such as BGA, TSOP, QFP, SON, QFN, C4 or CSP packages, or DOC chips directly on the module circuit board 20. The information storage chip components may be separated The package can also be an SOC product or SIP product integrated with the drive control chip component.

[0072] Regarding a specific but non-limiting structure of the outer clip fastener 40, in a preferred example, the outer clip fastener 40 is provided with an outwardly protruding elastic piece 44 on the middle fitting portion 41, The middle attachment portion 41 and the side clip attachment portion 42 are formed with a plurality of spring claws 45 whose middle sections are curved outwardly toward the side of the optical fiber interface 12; preferably, the elastic sheet 44 is located in the middle In the opening 46 of the fitting portion 41, the elastic sheet 44 is integrally connected to the side of the opening 46 that is relatively adjacent to the insertion port 13; preferably, the outer clip 40 is clamped on the side The attachment portion 42 is provided with a first inner buckle convex point 47, and the buckling portion 43 is provided with a second inner buckle convex point 48, which are respectively buckled and positioned to the side wall of the cover 10 and the bottom of the base 30 . Therefore, the elastic sheet 44 of the middle bonding portion 41, the spring claw 45 on the side of the middle bonding portion 41 and the side clip bonding portion 42 are used to make the heat-dissipating single/dual fiber pluggable light The module can be installed in a slot of a telecommunication device such as a switch in a pluggable manner, and the external clamping mechanism of the heat-dissipating single/dual fiber pluggable optical module does not directly affect or press the cover 10 and the base A combination of 30. Preferably, the specific connection orientation of the elastic sheet 44 is used to facilitate the sliding insertion of the heat-dissipating single/dual fiber pluggable optical module. Preferably, the outer clip fastener 40 is used on the first inner buckle projection 47 of the side clip attachment portion 42 and the second inner buckle projection 48 of the buckle portion 43 to strengthen the outer The clip 40 is attached to the cover 10 and the base 30 for non-slip positioning and heat conduction.

[0073] Regarding a specific but non-limiting combination of the cover 10 and the base 30, in a preferred example, the cover 10 and the base 30 are provided with the outer clip The grooves 17, 37 of the piece 40. Therefore, using the grooves 17, 37 to inlay the outer clip fastener 40, the heat-dissipating single/dual fiber pluggable optical module with the outer clip fastener 40 is more integrated and avoids the outer clip fastener Piece 40 directly scratches the slot of the telecommunications equipment.

[0074] Regarding a specific but non-limiting way of fixing the module circuit board 20 in the housing cover 10, in a preferred example, the housing cover 10 is provided with positioning bars 18 on the inner surface of the side wall, so The side of the module circuit board 20 is formed with a corresponding half-hole-shaped positioning notch 28; preferably, the cover 10 is longer than the base 30, and the cover 10 is provided with a buckle recess on the bottom edge of the side wall 19. The base 30 is provided with a correspondingly shaped buckle flange 39 facing the plug-in port 13, and the locking point 70 of the cover 10 and the base 30 is adjacent to the optical fiber interface 12. Therefore, by using the positioning bar 18 of the housing cover 10 to correspond to the half-hole-shaped positioning notch 28 of the module circuit board 20, the module circuit board 20 is fixed in the housing cover 10 without sliding, which stabilizes all The thermal coupling relationship between the chip heating body 26 and the heat conducting boss 16 on the module circuit board 20 is described. Preferably, the buckle recess 19 on the bottom edge of the side wall of the cover 10 and the buckle flange 39 of the base 30 are used to buckle each other to realize that the cover 10 and the base 30 are inserted in the The combination of the vicinity of the pull-out port 13 does not require a locking point 70 or a locking member, and only the locking point 70 needs to be installed adjacent to the optical fiber interface 12 to complete the housing cover 10 with a small number of locking points 70. Quick combination with the base 30. In this example, the positioning bar 18 is a multi-section structure that becomes thinner section by section, such as Figure 5 Shown. In this example, the locking point 70 is a through hole structure in the base 30, the locking point 70 is a locking hole structure in the cover 10, and the locking point 70 also includes a screw and other coupling parts, which pass through The base 30 is coupled to the cover 10.

[0075] Regarding a specific but non-limiting way for the base 30 to clamp the module circuit board 20, in a preferred example, the base 30 has a thickened side wall clip 31 (such as Image 6 (A) is used to clamp and touch the board side edge of the module circuit board 20 and the side wall edge of the shell cover 10 surrounding the board side edge. Therefore, using the thickened side wall clip 31 of the base 30 to clamp and fix the module circuit board 20 inside, the side wall clip 31 serves as a clip to contact the module circuit board 20 and the cover 10 side The support of the edge of the wall can realize that the clamping force of the base 30 to the cover 10 is greater than the clamping force of the base 30 to the module circuit board 20, thereby reducing circuit damage to the internal circuit of the module circuit board 20.

[0076] Regarding a preferred clamping relationship between the module circuit board 20 and the base 30, in a preferred example, the module circuit board 20 is provided on the plug port 13 facing the housing cover 10 of the first finger contact pad 21 (such as image 3 Shown) and the second finger-shaped contact pad 22 exposed on the base 30 (such as figure 2 Shown); The module circuit board 20 is fixed in the housing cover 10, and the module circuit board 20 is in slidable contact with the base 30. Therefore, the module circuit board 20 is fixed in the housing cover 10 in a slidable contact with the module circuit board 20 and the base 30, even if the optical module is running at a high speed. The mismatched heating of the base 30 will not cause stress damage to the circuit structure in the module circuit board 20.

[0077] See again Figure 4 The present invention also provides a heat-dissipating single/dual-fiber pluggable optical module outer clip fastener 40, which has a middle bonding portion 41 and side clip bonding portions bent and extended from both sides of the middle bonding portion 41 42 and the buckling portion 43 bent and extended by the side clip attaching portion 42. The middle attaching portion 41 and the side clip attaching portion 42 are used for thermally attaching the heat-dissipating single/dual fiber Plug the cover 10 of the optical module, the buckling part 43 is used to thermally buckle the base 30 of the heat-dissipating single/dual fiber pluggable optical module; preferably, the outer clip fastener 40 is in the The middle bonding portion 41 is provided with an outwardly protruding elastic piece 44, and a plurality of spring claws with middle sections curved outward are formed on the side of the middle bonding portion 41 and the side clip bonding portion 42 facing the optical fiber interface 12 45; Preferably, the elastic sheet 44 is located in the opening 46 of the middle fitting portion 41, and the elastic sheet 44 is integrally connected to the side of the opening 46 that is relatively adjacent to the plug port 13; preferably, The outer clip fastener 40 is provided with a first inner buckle convex point 47 on the side clip attaching portion 42 and a second inner buckle convex point 48 on the buckling portion 43, which is used for buckling and positioning to the respective The side wall of the cover 10 and the bottom of the base 30. Utilizing the specific structure of the buckling portion 43 to achieve the overall thermal connection of the pluggable optical module, avoid the excessive heat temperature difference between the base 30 and the cover 10, and accelerate the external heat conduction effect of the pluggable optical module .

[0078] Figure 8 Shows a flow block diagram of a heat dissipation type single/dual fiber pluggable optical module assembly method according to the second preferred embodiment of the present invention; Picture 9 It shows a schematic diagram of the housing cover 10 provided in the assembly method; Picture 10 It shows a schematic diagram of the module circuit board 20 and the single/dual fiber optical transceiver module 50 being reversely installed in the housing cover 10 in the assembly method; Picture 11 It shows a schematic diagram of combining the base 30 on the cover 10 in the assembly method; Picture 12 It is a schematic diagram showing that an outer clamp 40 is provided on the outer periphery of the cover 10 to fasten the base 30 in this assembly method. The assembly method includes the following main steps.

[0079] in Figure 8 Can be compared in step S1 Picture 9 , Provide shell cover 10. The inside of the cover 10 is formed as an elongated device accommodating groove 11, one end of the device accommodating groove 11 is an optical fiber interface 12, and the other end is a plug-in port 13, and the device accommodating groove 11 is adjacent to the The optical fiber interface 12 is provided with a first positioning concave ring 14, a limiting notch 15 is provided adjacent to the plug-in port 13, and a thermally conductive boss 16 is formed in the device containing groove 11.

[0080] in Figure 8 Can be compared in step S2 Picture 10 , The module circuit board 20 and the single/dual fiber optical transceiver assembly 50 are reversely installed in the housing cover 10. The module circuit board 20 and the single/dual fiber optical transceiver assembly 50 are reversely installed in the device accommodating groove 11, and the module circuit board 20 is electrically connected to the single/dual fiber optical transceiver assembly 50, and the module circuit board A chip heating element 26 is provided on the 20, the single/dual fiber optical transceiver assembly 50 has a positioning ring 54, and the side of the module circuit board 20 has a board limit portion 25; when the module circuit board 20 is installed with After the single/dual fiber optical transceiver assembly 50, the single/dual fiber optical transceiver assembly 50 is fixed to the first positioning concave ring 14 via a part of the positioning ring 54, and the module circuit board 20 passes through the The plate limiting portion 25 is limited to the limiting notch 15, and the thermally coupling position of the heat conducting boss 16 corresponds to the chip heating body 26.

[0081] in Figure 8 Can be compared in step S3 Picture 11 , The base 30 is combined with the cover 10. The base 30 is provided with a second positioning concave ring 34 facing the optical fiber interface 12, and the single/dual fiber optical transceiver assembly 50 is fixed to the second positioning concave ring 34 via the rest of the positioning ring 54. And the side edge of the module circuit board 20 is clamped and fixed between the housing cover 10 and the base 30, and the heat conducting boss 16 is formed between the module circuit board 20 and the housing cover 10 The first heat convection passage 61 of the module circuit board 20 and the base 30 form a second heat convection passage 62, the first heat convection passage 61 and the second heat convection passage 62 They are all connected to the plug port 13.

[0082] in Figure 8 Can be compared in step S4 Picture 12 , An outer clip fastener 40 is provided on the outer periphery of the cover 10 to fasten the base 30. An outer clip 40 is provided on the outer periphery of the shell cover 10 corresponding to the first positioning concave ring 14. The outer clip 40 has a middle fitting part 41, and two sides of the middle fitting part 41 Bending and extending side clip attaching portion 42 and buckling portion 43 bent and extended by the side clip attaching portion 42. The middle attaching portion 41 and the side clip attaching portion 42 are thermally attached to the shell In the cover 10, the buckling portion 43 is thermally buckled to the base 30 to establish a heat conduction path from the thermally conductive boss 16 to the base 30 via the outer clip fastener 40. In this example, the pull ring 80 at the optical fiber interface 12 can also be assembled together.

[0083] The implementation principle of this embodiment is: the module circuit board 20 and the single/dual fiber optical transceiver assembly 50 are reversely installed, the module circuit board 20 is pre-positioned and arranged in the housing cover 10, and the module The circuit board 20 is sandwiched between the cover 10 and the base 30 and does not directly generate a mechanical connection with the base 30, and provides two thermal convection channels communicating up and down the module circuit board 20 and surrounding two The circular heat conduction path of the heat convection channel, the pluggable optical module has better external heat conduction effect under the air cooling mode, and is suitable for the production of a new generation of more advanced optical module products.

[0084] In a preferred example, in the step of installing the module circuit board 20, the chip heating body 26 includes at least two of an optical signal receiving/transmitting drive chip assembly, a drive control chip assembly, and an information storage chip assembly. There are a plurality of the heat conducting bosses 16 and the area is slightly larger than the chip heating body 26.

[0085] Alternatively, in the step of setting the outer clip fastener 40, the outer clip fastener 40 is provided with an outwardly protruding elastic piece 44 on the middle bonding portion 41, and the middle bonding portion 41 and the The side clip attachment portion 42 is formed with a plurality of spring claws 45 whose middle sections are bent outwardly toward the side of the optical fiber interface 12; preferably, the elastic sheet 44 is located in the opening 46 of the middle attachment portion 41, The elastic sheet 44 is integrally connected to the side of the opening 46 that is relatively adjacent to the insertion port 13; preferably, the outer clip fastener 40 is provided with a first inner buckle protrusion on the side clip attachment portion 42 Point 47. The buckling part 43 is provided with a second inner buckle convex point 48, which is respectively buckled and positioned to the side wall of the cover 10 and the bottom of the base 30.

[0086] In a preferred example, in the step of combining the base 30 and the cover 10, the cover 10 and the base 30 have grooves 17, 37 for inserting the outer clamp 40 .

[0087] In a preferred example, in the step of providing the housing cover 10, the housing cover 10 is provided with positioning strips 18 on the inner surface of the side wall; in the step of installing the module circuit board 20, the module circuit board A corresponding half-hole-shaped positioning notch 28 is formed on the side of 20; preferably, in the step of combining the base 30 and the cover 10, the cover 10 is longer than the base 30, and the cover 10 is provided with a buckle recess 19 on the bottom edge of the side wall, the base 30 is provided with a buckle flange 39 corresponding to the shape toward the plug-in port 13, and the locking point of the cover 10 and the base 30 70 is adjacent to the optical fiber interface 12.

[0088] In a preferred example, in the step of combining the base 30 and the cover 10, the base 30 has a thickened side wall clip 31 for clamping and touching the side edge of the module circuit board 20 And the cover 10 surrounds the side wall edge of the side edge of the board.

[0089] In a preferred example, the module circuit board 20 is provided with a first finger contact pad 21 facing the cover 10 and a second finger contact pad exposed on the base 30 at the plug port 13 22; After the step of setting the outer clamp 40, the module circuit board 20 is fixed in the housing cover 10, the module circuit board 20 and the base 30 are in slidable contact .

[0090] The examples of this specific implementation mode are all preferred examples to facilitate the understanding or implementation of the technical solutions of the present invention, and do not limit the protection scope of the present invention accordingly. All equivalent changes made in accordance with the structure, shape, and principle of the present invention, All should be covered within the scope of protection of the present invention.