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Method for preparing super-hydrophobic surfaces of electrolytic copper matrixes

A technology of superhydrophobic surface and copper substrate, applied in the field of electrochemistry, can solve the problems of poor stability of superhydrophobic surface and complicated process, and achieve the effects of environmental friendliness, simple preparation process and short time consumption.

Inactive Publication Date: 2020-06-02
DALIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problems of poor stability and complicated process in the preparation of the existing super-hydrophobic surface, and propose a method for preparing the super-hydrophobic surface of the electrolytic copper substrate

Method used

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  • Method for preparing super-hydrophobic surfaces of electrolytic copper matrixes
  • Method for preparing super-hydrophobic surfaces of electrolytic copper matrixes

Examples

Experimental program
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Effect test

Embodiment 1

[0019] Step 1: Polish two copper substrates with a size of 50mm×10mm×1mm sequentially with 800, 1500 and 3000 mesh water sandpaper until the surface is smooth, so as to remove the oxide layer on the surface of the copper substrate. Then the polished copper substrate is rinsed with deionized water and absolute ethanol in turn, and placed in a vacuum drying oven with a temperature environment of 50 degrees Celsius to dry for use;

[0020] Step 2. Dissolve 47.54g of nickel chloride hexahydrate and 14.9g of potassium chloride powder in deionized water, set the volume to 200mL, and stir well to obtain a concentration of nickel chloride of 1mol / L and a concentration of potassium chloride of 1mol / L. the electrolyte;

[0021] Step 3: Place the electrolyte solution described in step 2 in the electrolytic cell, connect the two copper substrates dried in step 1 as the anode and the cathode to the positive and negative poles of the programmable DC power supply, and adjust the two copper s...

Embodiment 2

[0025] Step 1: Polish two copper substrates with a size of 50mm×10mm×1mm sequentially with 800, 1500 and 3000 mesh water sandpaper until the surface is smooth, so as to remove the oxide layer on the surface of the copper substrate. Then the polished copper substrate is rinsed with deionized water and absolute ethanol in turn, and placed in a vacuum drying oven with a temperature environment of 50 degrees Celsius to dry for use;

[0026] Step 2. Dissolve 33.28g of nickel chloride hexahydrate and 10.43g of potassium chloride powder in deionized water, set the volume to 200mL, and stir evenly to obtain a nickel chloride concentration of 0.7mol / L and a potassium chloride concentration of 0.7mol / L electrolyte;

[0027] Step 3: Place the electrolyte solution described in step 2 in the electrolytic cell, connect the two copper substrates dried in step 1 as the anode and the cathode to the positive and negative poles of the programmable DC power supply, and adjust the two copper subs...

Embodiment 3

[0030] Step 1: Polish two copper substrates with a size of 50mm×10mm×1mm sequentially with 800, 1500 and 3000 mesh water sandpaper until the surface is smooth, so as to remove the oxide layer on the surface of the copper substrate. Then the polished copper substrate is rinsed with deionized water and absolute ethanol in turn, and placed in a vacuum drying oven with a temperature environment of 50 degrees Celsius to dry for use;

[0031] Step 2. Dissolve 71.31g of nickel chloride hexahydrate and 22.35g of potassium chloride powder in deionized water, set the volume to 200mL, and stir evenly to obtain a concentration of nickel chloride of 1.5mol / L and a concentration of potassium chloride of 1.5mol / L electrolyte;

[0032] Step 3: Place the electrolyte solution described in step 2 in the electrolytic cell, connect the two copper substrates dried in step 1 as the anode and the cathode to the positive and negative poles of the programmable DC power supply, and adjust the two coppe...

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Abstract

The invention belongs to the technical field of materials, and provides a method for preparing super-hydrophobic surfaces of electrolytic copper matrixes. Micro-nano composite structures are formed onthe surfaces of the copper matrixes through an electrolyte in an electrochemical corrosion manner, and the surfaces have super-hydrophobicity, wherein according to machining parameters, the current density is 20 mA / cm<2>-150 mA / cm<2>, the electrolysis time is 3 min-7 min, and the distance between the two copper matrixes is 50 mm. The electrolyte used in the preparation process is low in cost andenvironmentally friendly, the preparation technology is simple and short in time, the prepared copper surfaces have high super-hydrophobicity, and the contact angle can reach 160 degrees. The super-hydrophobicity can be kept stable after the surfaces are placed under conventional conditions for a month.

Description

technical field [0001] The invention belongs to the technical field of materials and relates to an electrochemical method for preparing a super-hydrophobic surface on a copper substrate. Background technique [0002] When the contact angle between the surface and water exceeds 150°, the surface is called a superhydrophobic surface. The proposal of the superhydrophobic surface is inspired by natural structures (such as lotus leaves, mosquito compound eyes, butterfly wings, etc.). Superhydrophobic surfaces can be applied in many fields of life, such as self-cleaning, boiling, flow drag reduction and other fields. Applying the superhydrophobic surface to the surface of inorganic substances can play a self-cleaning effect; applying the superhydrophobic surface to metal materials can reduce the superheat of the initial boiling of the surface; applying the superhydrophobic surface to the flow in the tube is beneficial to reduce the fluid flow resistance. Therefore, it is of grea...

Claims

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Application Information

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IPC IPC(8): C25F3/02
CPCC25F3/02
Inventor 高林松吕继组白敏丽
Owner DALIAN UNIV OF TECH
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