Method for preparing ultra-thick graphene heat dissipation film

A technology of ene heat dissipation film and graphene film, which is applied in the field of preparing ultra-thick graphene heat dissipation film, can solve the problems of inability to prepare thick graphene film, and achieve the effects of controllable film thickness, easy large-scale production, and simple process

Pending Publication Date: 2020-06-05
STONEPLUS THERMAL MANAGEMENT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] One of the objects of the present invention is to provide a method for preparing ultra-thick graphene heat dissipation film, which has simple preparation process, high efficiency and easy operation, and solves the problem that thick graphene film cannot be prepared

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] In this embodiment, a method for preparing an ultra-thick graphene heat dissipation film is as follows:

[0040] Disperse graphite oxide in deionized water to form a graphite oxide dispersion, and use a high-speed shear to peel off the graphite oxide to obtain a graphene oxide solution. The speed of the high-shear machine is 20000r / min, and the dispersion time is 10min. The graphene oxide solution was concentrated using a rotary evaporator, the temperature was set at 58° C., the concentration time was 400 min, and the solid content was 5%. The concentrated graphene oxide slurry was vacuum defoamed, and the vacuum degree was -1bar, and kept for 10min.

[0041] Utilize the oriented arrangement of graphene oxide under the action of shearing, use a scraper to coat the graphene oxide slurry on the PET release film with a coating thickness of 20mm, PET is a grid release film with a thickness of 140μm, and the release force 10-15g, the oven temperature is 80°C, keep for 50min...

Embodiment 2

[0044] In this embodiment, a method for preparing an ultra-thick graphene heat dissipation film is as follows:

[0045]Disperse graphite oxide in deionized water to form a graphite oxide dispersion, and use an ultrasonic cleaner to peel off graphite oxide to obtain a graphene oxide solution with a power of 800W and an ultrasonic time of 30 minutes. The graphene oxide solution was concentrated using a rotary evaporator, the temperature was set at 70° C., the concentration time was 240 min, and the solid content was 7%. The concentrated graphene oxide slurry was vacuum defoamed, and the vacuum degree was -1bar, and kept for 10min.

[0046] Utilize the oriented alignment of graphene oxide under shearing action, use a scraper to coat the graphene oxide slurry on the PET release film with a coating thickness of 50mm, PET is a grid release film with a thickness of 140μm, and the release force 5-10g, the oven temperature is 90°C, keep for 60min, and then the film is peeled off from ...

Embodiment 3

[0048] In this embodiment, a method for preparing an ultra-thick graphene heat dissipation film is as follows:

[0049] Disperse graphite oxide in deionized water to form a graphite oxide dispersion, use a high-speed shear to peel off the graphite oxide to obtain a graphene oxide solution, the speed of the high-shear machine is 10000r / min, and the dispersion time is 30min. The graphene oxide solution was concentrated using a rotary evaporator, the temperature was set at 80° C., the concentration time was 200 min, and the solid content was 8%. The concentrated graphene oxide slurry was vacuum defoamed, and the vacuum degree was -1bar, and kept for 10min.

[0050] Utilize the oriented arrangement of graphene oxide under the action of shearing, use a scraper to coat the graphene oxide slurry on the PET release film with a coating thickness of 2mm, PET is a grid release film with a thickness of 140μm, and the release force 10-15g, the temperature of the oven is 80°C, keep for 50m...

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Abstract

The invention relates to the field of graphene heat dissipation, in particular to a method for preparing an ultra-thick graphene heat dissipation film. The graphene heat dissipation film obtained by the method can be used as a rapid heat dissipation film for a 3C product, such as a smart phone, a notebook computer, VR wearable equipment and the like. The preparation method mainly comprises the following steps: dissolving, stripping and dispersing graphite oxide filter cake in deionized water; coating and stripping the dispersed slurry; and carrying out thermal reduction on the obtained graphene film to prepare the ultra-thick graphene heat dissipation film. The method is simple in process and low in production cost and energy consumption, and the defects that an original artificially synthesized graphite film is low in heat flux, poor in mechanical property, capable of generating tar pollutants in the production process and the like are overcome; compared with a traditional artificially synthesized graphite film, the disclosed graphene heat dissipation film prepared by the method is adjustable in thickness and can be used as a rapid heat dissipation film of a 3C product.

Description

technical field [0001] The invention relates to the technical field of graphene film production, in particular to a method for preparing an ultra-thick graphene heat dissipation film. Background technique [0002] Smart electronic devices have become an indispensable part of people's work and life, such as smart phones, portable notebook computers, smart VR wearable devices, etc. With the continuous improvement of the intelligence of these electronic devices, the power requirements for electronic devices have also increased synchronously, resulting in a large amount of heat generated during the operation of the equipment, which poses a great threat to the reliable operation of the equipment. Heat dissipation materials have become an important way to solve the overheating of current intelligent electronic equipment, and are the key guarantee for the reliable and high-speed operation of intelligent electronic equipment. At present, the most widely used thermal conductive synt...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C01B32/192C01B32/194
CPCC01B32/192C01B32/194C01B2204/04C01B2204/24C01B2204/26
Inventor 吴召洪
Owner STONEPLUS THERMAL MANAGEMENT TECH
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