Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A kind of flexible conductive film and its preparation method, sensor

A flexible conductive and flexible film technology, applied in chemical instruments and methods, electromagnetic measuring devices, electric/magnetic solid deformation measurement, etc., can solve the problems of flexible conductive films that are easy to break, and achieve improved stretching range and high stretching sensitivity , Good device stability and repeatability

Active Publication Date: 2022-01-25
BEIJING INST OF CARBON BASED INTEGRATED CIRCUIT +2
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the above technical problems, the application provides a flexible conductive film and its preparation method, sensor, to solve the problem that the flexible conductive film is easy to break under stretching

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of flexible conductive film and its preparation method, sensor
  • A kind of flexible conductive film and its preparation method, sensor
  • A kind of flexible conductive film and its preparation method, sensor

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0065] Correspondingly, the embodiment of the present application also provides a method for preparing a flexible conductive film, such as Figure 7 shown, including:

[0066] S101: Provide a substrate, the first surface of the substrate is arranged with a plurality of grooves of preset shapes; refer to Figure 8 , Figure 8 is a schematic cross-sectional structure diagram of the substrate; Figure 8 Among them, 40 represents the substrate, and when the substrate is an anodized aluminum template, the reference numeral 41 represents the aluminum metal layer, 42 represents the first aluminum oxide layer, and 43 represents the second aluminum oxide layer.

[0067] S102: Form a flexible thin film on the first surface of the substrate, the flexible thin film includes a microstructure protruding into the groove and a main body covering the exposed surface of the microstructure and the first surface; refer to Figure 9 , Figure 9 is a schematic diagram of the substrate and its s...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
diameteraaaaaaaaaa
diameteraaaaaaaaaa
heightaaaaaaaaaa
Login to View More

Abstract

The application discloses a flexible conductive film and its preparation method and sensor. During the stretching process of the flexible conductive film, the stretching deformation is mainly caused by the bottom of the microstructure around the deformation buffer unit of the flexible film, and most of the stretching deformation is perpendicular to the stretching process. The cracks in the direction of stretching expand with the increase of stretching degree, so that the resistance of the conductive film in the stretching direction increases significantly, so that it has a high stretching sensitivity. In addition, during the stretching process, the morphology of the microstructure is almost unchanged, and there are fewer gully cracks between the connected deformation buffer units in the flexible film parallel to the stretching direction, thus forming micro-islands of connected deformation buffer units, ensuring The flexible conductive film can still conduct current under a tensile strain of nearly 70%, which improves the stretching range of the device. After the stress is released, the flexible film returns to the size before the force is applied, the cracks are closed, and the resistance of the conductive film layer returns to the original size, so that the flexible conductive film layer can be repeatedly stretched and reused.

Description

technical field [0001] The present application relates to the technical field of sensing equipment, and more specifically, relates to a flexible conductive film, a preparation method thereof, and a sensor. Background technique [0002] In applications such as strain sensors, the flexible conductive film refers to a flexible film and a conductive film layer disposed on the flexible film. [0003] In applications such as strain sensors, when the flexible conductive film is deformed due to external pressure, both the flexible film and the conductive film layer will be deformed accordingly, and the resistance of the conductive film layer will change accordingly with the deformation of the conductive film layer. Change, by measuring the resistance change of the conductive film layer when deformation occurs, the magnitude of the external pressure on the flexible conductive film layer or the deformation of the flexible conductive film can be known through the specific corresponding...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B32B33/00B32B27/06B32B27/28B32B15/08B32B9/00B32B9/04B32B37/24B32B38/10G01B7/16
CPCB32B33/00B32B27/06B32B27/283B32B15/08B32B9/007B32B9/041B32B37/24B32B38/10G01B7/18B32B2037/243B32B2307/202
Inventor 刘又地曾祥雯胡又凡
Owner BEIJING INST OF CARBON BASED INTEGRATED CIRCUIT
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products