Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A High-Density Service Modular System Based on Orthogonal Architecture

A service module, high-density technology, applied in the field of high-density service modular systems, can solve the problems of long development cycle of large-scale servers, inability to use general-purpose servers, and lack of experience in x86 server design, so as to shorten the development cycle and improve product reliability. The effect of stability, wide applicability

Active Publication Date: 2022-04-12
深圳市时代通信技术有限公司
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] 1. No x86 server design experience
[0007] 2. Due to the private nature of the manufacturer's orthogonal architecture, standard general-purpose servers cannot be used
[0008] 3. The challenge of achieving large bandwidth for servers on an orthogonal architecture
[0009] Existing applications require more and more high-density servers, and traditional 2S servers can no longer meet the demand; large-scale servers have a long R&D cycle, and customer needs are differentiated, so there is an urgent need to shorten the R&D cycle

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A High-Density Service Modular System Based on Orthogonal Architecture
  • A High-Density Service Modular System Based on Orthogonal Architecture
  • A High-Density Service Modular System Based on Orthogonal Architecture

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0033] The present invention provides a technical solution: a high-density service modular system based on an orthogonal framework, including a single-board system, and the block diagram of the single-board system is as follows figure 1 As shown, on the physical interface, the backplane is composed of front panel interface, backplane interface, board-to-board mezzanine connector interface and storage interface connector. The board mainly includes dual 25GE port...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a high-density service modular system based on an orthogonal framework, which includes a single board system. On the physical interface, the bottom board is composed of a front panel interface, a backplane interface, and a board-to-board interlayer connector interface in the board, storage Composed of interface connectors, the board mainly includes dual 25GE port PCIE network card chip XXV710, 4-port Gigabit PHY chip 88E1543, VGA graphics card SM750, CPLD, IPMC, clock BUFFER and power conversion circuit. This is a high-density service module based on an orthogonal architecture The system improves product reliability and shortens the R&D cycle through the modular design of CPU sub-cards. The streamlined module interface design has wide applicability. The compact shape not only ensures high-density layout, but also reserves enough expansion for the interface board space.

Description

technical field [0001] The invention relates to the field of communication and server application technology for telecom operators and enterprise customers, and specifically relates to a high-density service modular system based on an orthogonal framework. Background technique [0002] With the rapid development of the Internet and mobile Internet, various Internet+ applications emerge in an endless stream, and the demand for network and bandwidth continues to rise. The backbone network and metropolitan area network have already used 100Gbps optical transmission, which is the mainstream of network interconnection. At the same time, the standard of the network interconnection interface is also constantly improving, according to the evolution rate of 100G→400G→800G, which puts forward higher requirements for the network processing platform. [0003] Since the traditional communication equipment structure cannot adapt to such high-bandwidth processing, in recent years, various ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/18
CPCG06F1/185
Inventor 陈嘉琪罗先林
Owner 深圳市时代通信技术有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products