Grain size and performance controllable sputtering target material copper plate and strip production process
A sputtering target and production process technology, which is applied in the field of sputtering target copper strip production process, can solve the problems of poor annealing quality, high requirements, and low production volume, and achieve grain refinement, increased ductility and Toughness, anti-deformation effect
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[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.
[0025] refer to figure 1 , a sputtering target copper strip production process with controllable grain size and performance, comprising the following steps,
[0026] Step 1: Melting and casting copper billets, adding electrolytic copper into the oxygen-free copper furnace, adding phosphorus and charcoal, degassing through bottom blowing, removing slag, adjusting the temperature in the furnace to 1200-1250 °C to obtain molten copper water of C10100, and Transfer the copper water to the holding furnace; increase the coverage of graphite particles in the holding furnace, and continue to adjust the composition; after the copper water reaches the specified level, the temp...
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