Unlock instant, AI-driven research and patent intelligence for your innovation.

Grain size and performance controllable sputtering target material copper plate and strip production process

A sputtering target and production process technology, which is applied in the field of sputtering target copper strip production process, can solve the problems of poor annealing quality, high requirements, and low production volume, and achieve grain refinement, increased ductility and Toughness, anti-deformation effect

Inactive Publication Date: 2020-06-19
中铜华中铜业有限公司
View PDF7 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, with the continuous development of industrial technology, the quality and precision requirements of copper strips are getting higher and higher, and the traditional rolling method can no longer meet the requirements of high-quality copper strips
The annealing quality in the copper strip production process is poor, the parameter setting is not ideal, and the production operation is cumbersome, so that the produced copper strip cannot meet the production requirements
[0003] Copper strips are also mostly used for targets. Due to the high requirements for target composition, grain size and physical and chemical properties, the existing targets are mainly produced through the production process designed by forging equipment, which requires higher requirements for blanks and forging equipment. With production, the production volume is small, and it cannot be mass-produced

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Grain size and performance controllable sputtering target material copper plate and strip production process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0025] refer to figure 1 , a sputtering target copper strip production process with controllable grain size and performance, comprising the following steps,

[0026] Step 1: Melting and casting copper billets, adding electrolytic copper into the oxygen-free copper furnace, adding phosphorus and charcoal, degassing through bottom blowing, removing slag, adjusting the temperature in the furnace to 1200-1250 °C to obtain molten copper water of C10100, and Transfer the copper water to the holding furnace; increase the coverage of graphite particles in the holding furnace, and continue to adjust the composition; after the copper water reaches the specified level, the temp...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Purityaaaaaaaaaa
Login to View More

Abstract

The invention relates to the technical field of copper plate and strip production processes, in particular to a grain size and performance controllable sputtering target material copper plate and strip production process. The grain size and performance controllable sputtering target material copper plate and strip production process comprises the following steps that 1, a copper blank is casted; 2, surface milling is conducted; 3, hot rolling is conducted, specifically, the copper blank is taken out of a furnace after being heated to 800-900 DEG C, the rolling process is conducted 7-11 times,and the final rolling temperature is within 600-650 DEG C; 4, on-line quenching is conducted, the temperature is rapidly controlled within 200 DEG C, and therefore it is guaranteed that the grain sizeis within 70 microns, and the hardness is within 100 HV; 5, secondary surface milling is conducted; 6, annealing is conducted; 7, surface treatment is conducted; and 8, packaging is conducted. According to the method, existing equipment is fully utilized, the content of Cu is controlled to reach the standard for high-purity oxygen-free copper of cast ingots produced through the casting, in the hot rolling production process, the grain size is controlled by controlling the heating temperature, the rolling passes, the finish rolling temperature and the rapid quenching, finally, the grain size uniformity and the physical performance meet the requirements of customers in a bell-type furnace annealing mode, the production efficiency is improved, and the product quality is also improved.

Description

technical field [0001] The invention relates to the technical field of copper strip production technology, in particular to a sputtering target copper strip production technique with controllable grain size and performance. Background technique [0002] At present, copper strip production is mainly carried out by ingot hot rolling. However, with the continuous development of industrial technology, the quality and precision requirements of copper strips are getting higher and higher, and the traditional rolling method can no longer meet the requirements of high-quality copper strips. The annealing quality in the copper strip production process is poor, the parameter setting is not ideal, and the production operation is cumbersome, so that the produced copper strip cannot meet the production requirements. [0003] Copper strips are also mostly used for targets. Due to the high requirements for target composition, grain size and physical and chemical properties, the existing t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B23P15/00
CPCB23P15/00
Inventor 张武
Owner 中铜华中铜业有限公司