voltage regulation module

Abstract

The present invention provides a voltage regulating module, which includes a first printed circuit board assembly, which includes a plurality of conductive pads; and a signal connection part, placed vertically on the first printed circuit board assembly, and includes a plurality of conductive fingers and A conductive printed circuit board with a plurality of surface-mounted feet, a plurality of conductive fingers formed on at least one side of the conductive printed circuit board, and a plurality of surface-mounted feet formed on the top surface of the conductive printed circuit board by electroplating and the bottom surface, the first end of each conductive finger is connected to the corresponding surface mount pin on the top surface for conduction, and the second end of each conductive finger is connected to the corresponding surface mount pin on the bottom surface for conduction connection, the signal The connecting portion is soldered, fixed and electrically connected to the first printed circuit board assembly through the plurality of conducting pads and corresponding surface mount feet of the first printed circuit board assembly.

Description

technical field [0001] The present invention relates to a voltage regulating module, in particular to a voltage regulating module capable of reducing loss, increasing heat dissipation efficiency, increasing pressure resistance capability, setting more output capacitors and / or reducing volume. Background technique [0002] see Figure 1A and Figure 1B ,in Figure 1A is a structural schematic diagram of the first type of existing electronic device, Figure 1B for Figure 1A Schematic diagram of the structure of the voltage regulation module shown. Such as Figure 1A and Figure 1B As shown, the existing electronic device 1 of the first type includes a central processing unit (Central Processing Unit; CPU) 11 , a voltage regulation module 12 and a system board 13 . The voltage regulation module 12 is used to convert the received input voltage into a regulated voltage and provide it to the central processing unit 11, and the voltage regulation module 12 and the central proce...

AI Technical Summary

Problems solved by technology

First of all, the first problem and the second problem are because the first side of the voltage regulation module needs to be soldered to the system board, and the second side of the voltage regulation module is fixed to the case of the electronic device through heat sinks and spring screws. Therefore, the first problem faced by the voltage regulation module is that it cannot effectively transfer heat energy to the casing of the electronic device to dissipate heat through the casing. Furthermore, the second problem faced by the voltage regulation module is that it cannot effectively improve The voltage regulation module bears the pressure from the heat sink and spring screws

The third problem is that since the output capacitor is changed to be set in the voltage regulation module, and the printed circuit board of the voltage regulation module usually contains multiple ball grid arrays, considering that the ball grid arrays may be cracked due to uneven force Or the situation of dropping tin will affect the reliability of the product. Therefore, it is necessary to provide a large space on the surface of the printed circuit board of the voltage regulation module to improve the design of the force of the ball grid array. In this way, the output capacitor will be improved. The setting space is limited, so that the voltage regulation module cannot set more output capacitors according to actual needs

The fourth problem is that there are usually components used to transmit signals in the voltage regulation module, such as a signal connection part composed of multiple conductive pins, wherein the multiple conductive pins of the signal connection part are inserted into the voltage regulation module. On the printed circuit board, due to the large spacing between the lead pins of the signal connection part, the number of lead pins that can be placed on the same area is small, so the distribution density of the lead pins is small, and because each lead The cross-sectional area of ​​the pins is small, which leads to poor reliability of the lead pins during the insertion process. In addition, the tin connection between the lead pins is also easy to short circuit

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