Reinforced polyamide 66 composition and preparation method thereof

A technology of polyamide and composition, applied in the field of reinforced polyamide 66 composition and its preparation, can solve the problems of poor dimensional stability, low impact strength and high dielectric constant, achieve low dielectric constant, improve impact performance, improve Compatibility effect

Inactive Publication Date: 2020-06-26
GUANGDONG ALDEX NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, polyamide has low notched impact strength, strong hygroscopicity, poor dimensional stability and high dielectric constant, so it is necessary to toughen PA and reduce the dielectric of the composition by blending other lower dielectric constant materials Constants to meet the needs of electronic and electrical engineering, integrated circuit packaging, electromagnetic wave shielding and other fields

Method used

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  • Reinforced polyamide 66 composition and preparation method thereof
  • Reinforced polyamide 66 composition and preparation method thereof
  • Reinforced polyamide 66 composition and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0096] This embodiment provides a reinforced polyamide 66 composition prepared from the following raw materials in parts by weight:

[0097] 60 parts of low-viscosity polyamide 66 resin,

[0098] High viscosity polyamide 66 resin 20 parts,

[0099] 20 parts of ethylene-octene copolymer grafted maleic anhydride,

[0100] The sum of the parts by weight of low-viscosity polyamide 66 resin, high-viscosity polyamide 66 resin and ethylene-octene copolymer grafted maleic anhydride is 100 parts,

[0101]

[0102] The preparation method of above-mentioned reinforced polyamide 66 composition, comprises the following steps:

[0103] (1) Place the low-viscosity polyamide 66 resin and the high-viscosity polyamide 66 resin at a temperature of 90° C. for 8 hours to dry, then cool, and the cooled low-viscosity polyamide 66 resin and high-viscosity polyamide 66 resin Polyamide 66 resin and the ethylene-octene copolymer graft maleic anhydride, polytetrafluoroethylene resin, antioxidant CY...

Embodiment 2

[0108] This embodiment provides a reinforced polyamide 66 composition prepared from the following raw materials in parts by weight:

[0109] Low viscosity polyamide 66 resin 93 parts,

[0110] High viscosity polyamide 66 resin 5 parts,

[0111] 2 parts of ethylene-octene copolymer grafted maleic anhydride,

[0112] The sum of the parts by weight of low-viscosity polyamide 66 resin, high-viscosity polyamide 66 resin and ethylene-octene copolymer grafted maleic anhydride is 100 parts,

[0113]

[0114] The preparation method of above-mentioned reinforced polyamide 66 composition, comprises the following steps:

[0115] (1) Place the low-viscosity polyamide 66 resin and the high-viscosity polyamide 66 resin at a temperature of 120° C. for 4 hours to dry, then cool, and the cooled low-viscosity polyamide 66 resin and high-viscosity polyamide 66 Polyamide 66 resin and the ethylene-octene copolymer graft maleic anhydride, polytetrafluoroethylene resin, antioxidant CY, bis(2,4-...

Embodiment 3

[0120] This embodiment provides a reinforced polyamide 66 composition prepared from the following raw materials in parts by weight:

[0121] 68 parts of low-viscosity polyamide 66 resin,

[0122] High viscosity polyamide 66 resin 16 parts,

[0123] 16 parts of ethylene-octene copolymer grafted maleic anhydride,

[0124] The sum of the parts by weight of low-viscosity polyamide 66 resin, high-viscosity polyamide 66 resin and ethylene-octene copolymer grafted maleic anhydride is 100 parts,

[0125]

[0126] The preparation method of above-mentioned reinforced polyamide 66 composition, comprises the following steps:

[0127] (1) Place the low-viscosity polyamide 66 resin and the high-viscosity polyamide 66 resin at a temperature of 100° C. for 6 hours, and then cool, and the cooled low-viscosity polyamide 66 resin and high-viscosity polyamide 66 resin Polyamide 66 resin and the ethylene-octene copolymer graft maleic anhydride, polytetrafluoroethylene resin, antioxidant CY, ...

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Abstract

The invention relates to a reinforced polyamide 66 composition and a preparation method thereof. The reinforced polyamide 66 composition is prepared from the following raw materials: polyamide 66-A resin, polyamide 66-B resin, ethylene-octene copolymer grafted maleic anhydride, hollow glass beads, a polyhedral oligomeric silsesquioxane polymer, low-dielectric-constant glass fibers, a titanate coupling agent, polytetrafluoroethylene resin, a hyperbranched polyester polymer, erucyl amide, an antioxidant CY, and bis(2,4-dicumylphenyl)pentaerythritol-diphosphite. The reinforced polyamide 66 composition has excellent mechanical properties, processability and low dielectric constant, and can be applied to shells, cladding and protective materials and the like of 5G base stations, micro base station systems, data communication terminals, antennas and radio frequency modules.

Description

technical field [0001] The invention relates to the field of materials, in particular to a reinforced polyamide 66 composition and a preparation method thereof. Background technique [0002] Dielectric materials, also known as dielectrics, are electrical insulating materials. According to performance, there are high dielectric materials and low dielectric materials. For low dielectric materials, with the rapid development of electronic information technology, electronic products are developing in the direction of lightweight, high performance and multifunctionality, and it is increasingly necessary to develop low dielectric constant ( D. k <3) Materials. At the same time, with the advent of the 5G era, the requirements for the transmission speed and loss of electronic signals are higher than those of 4G products. Usually, 4G products only require the dielectric constant of resin materials to be less than 3.7 (1GHz), while 5G products require The dielectric constant of...

Claims

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Application Information

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IPC IPC(8): C08L77/06C08L51/06C08L83/04C08L27/18C08L67/00C08K13/04C08K7/28C08K7/14C08K5/527C08K5/20C08K5/10C08J5/04
CPCC08L77/06C08J5/043C08L2205/035C08L2203/20C08L2205/025C08J2377/06C08J2477/06C08J2451/06C08J2483/04C08J2427/18C08J2467/00C08L51/06C08L83/04C08L27/18C08L67/00C08K13/04C08K7/28C08K7/14C08K5/527C08K5/20C08K5/10
Inventor 王忠强洪剑城卢健体蔡雄
Owner GUANGDONG ALDEX NEW MATERIAL CO LTD
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