Intelligent multi-dimensional multifunctional sensing and information processing integrated circuit

A technology of integrated circuits and large-scale integrated circuits, applied in the field of sensing, can solve problems such as poor device performance, inability to detect multiple information at the same time, and low reliability

Active Publication Date: 2020-07-03
林和
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is used to solve the single performance of existing sensors and sensing devices, which cannot detect multiple information at the same time and cannot realize the i

Method used

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  • Intelligent multi-dimensional multifunctional sensing and information processing integrated circuit
  • Intelligent multi-dimensional multifunctional sensing and information processing integrated circuit
  • Intelligent multi-dimensional multifunctional sensing and information processing integrated circuit

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Embodiment Construction

[0080] The preferred embodiments of the present invention will be described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0081] as attached figure 1 The shown intelligent multi-dimensional multifunctional sensing and information processing integrated circuit includes: a substrate, a transition layer and a superlattice VLSI layer, and the transition layer is arranged on the substrate and the supercrystalline between VLSI layers; among them,

[0082] The substrate is composed of one or more of silicon, compound semiconductor, gallium nitride, gallium arsonide or silicon carbide.

[0083] A transition layer composed of one or more of silicon dioxide, silicon carbide, and compound semiconductors is provided on the top of the substrate.

[0084] A superlattice VLSI layer based on two-dim...

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Abstract

The invention provides an intelligent multi-dimensional multifunctional sensing and information processing integrated circuit. The integrated circuit comprises a substrate, a transition layer and a super-lattice super-large-scale integrated circuit layer; the substrate is composed of one or more of silicon, a compound semiconductor, gallium nitride, gallium arsenide or silicon carbide; a transition layer consisting of one or more of silicon dioxide, silicon carbide and a compound semiconductor is arranged at the top of the substrate; and super-lattice super-large-scale integrated circuit layers created based on two-dimensional electron gas, two-dimensional hole gas and a quantum well circuit are formed at the top and on the side surface of the transition layer. The integrated circuit has the advantages of multiple functions, high performance, high reliability, design flexibility, simplified process, short production period, reasonable cost and the like.

Description

technical field [0001] The invention relates to the field of sensing technology, in particular to an intelligent multi-dimensional multifunctional sensing and information processing integrated circuit. Background technique [0002] At present, various sensors at home and abroad, such as photoelectric sensors, thermal sensors, magnetic sensors, position sensors, pressure sensors, acoustic wave sensors, etc., are all separate devices, or one-dimensional or two-dimensional arrays composed of separate devices. array. The current high-speed development of big data, artificial intelligence and comprehensive digital intelligent market applications urgently require new types of sensing and information processing integrated circuits with high performance, high reliability and acceptable cost, and more importantly, new types of sensing and information processing integration The circuit must also meet the special requirements of artificial intelligence and space age for ultra-high spe...

Claims

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Application Information

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IPC IPC(8): H01L21/762G01D5/14G01D5/26G01D5/48
CPCH01L21/76208G01D5/145G01D5/26G01D5/48
Inventor 林和
Owner 林和
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