Optical chip module testing device

Abstract

The invention discloses an optical chip module testing device which comprises an upper module and a lower module which are matched. The upper module comprises a test probe, the lower module comprisesa chip placing base, a chip placing groove is formed in the chip placing base, an installation space which is opposite to the chip placing groove and is communicated with the groove bottom of the chipplacing groove is formed in the chip placing base, and an LENS is arranged in the installation space in a translational mode. According to the scheme, the installation space corresponding to the chipplacing groove is formed in the chip placing base, and the LENS with the adjustable position is arranged in the installation space so that the horizontal position of the LENS can be flexibly adjustedaccording to test requirements, the centering precision of the center of the lens and the optical center of the chip is ensured to be within 0.01 mm, the error interference can be reduced and the precision of the test result can be improved.

Description

technical field [0001] The invention relates to the field of chip testing equipment, in particular to an optical chip module testing device. Background technique [0002] COM / QFP optical chip module is a module composed of a photosensitive chip and a related frame structure that emerged with circuit integration and optical integration. The circuit signal is exported using tinned copper wire or gold wire, etc. And the design of the step distance between tinned copper wire / gold wire is getting smaller and smaller, and it has reached about 0.2mm at present. [0003] During the processing of COM / QFP optical chip modules, it is necessary to test the performance of the chip through a special test device. During the test, the chip to be tested is usually placed in a fixture, and the pins of the chip are contacted by the test probe to cooperate with The corresponding test structure is tested. [0004] When testing the imaging performance of the chip, it is necessary to keep the al...

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Problems solved by technology

[0004] When testing the imaging performance of the chip, it is necessary to keep the alignment accuracy between the optical center of the optical chip module and the center of the lens within 0.01mm. , the position of the lens LENS is fixed and cannot be effectively adjusted to compensate for the above errors, which leads to low alignment accuracy of the optical chip module and the center of the lens, which affects the test accuracy

[0005] At the same time, during the test process, due to the light weight of the optical chip module, there may be a problem of position shift during the test pressure process, which also increases the probability of poor contact between the chip pins and the test probes, affecting the test accuracy. reliability

[0006] At present, the diameter of the pins of the chip module is basically within 0.05mm, and even the pins of many chips are within 0.03mm. At the same time, because the distance between the pins is about 0.2mm, the size of the test probe itself should not be too large. , and the existing various test probes, usually in order to make them have a certain stretching performance to avoid hard contact, the test probes are integrated with elastic parts such as springs, such as the test probes disclosed in the application numbers 201780069227.3 and 201080067768.0 , which makes the structure of the test probe complex and larger in size

[0007] There are also some test probes that use straight or polygonal special-shaped rhenium-tungsten needles, and their test ends are usually set in the shape of a ball or needle as shown in the above patent, which results in a short contact area between the test probe and the chip pin. , it is required that the tolerance range between the test probe and the chip pin or PAD is about 0.02mm to be in effective contact. However, due to the existence of various processing and assembly tolerances, it is easy to appear that the test probe and the chip pin cannot be effectively contacted. contact, resulting in a higher probability of an open circuit

[0008] There are also other probes that are shaped shrapnel, which are prone to deformation during use, resulting in inaccurate positioning

[0009] At the same time, the existing test probe structure greatly improves the processing and assembly accuracy requirements of other structures, which increases the difficulty of processing and assembly

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