Bi-component heat-conducting gel for 5G communication and preparation method thereof

A two-component, gel technology, applied in the field of two-component thermally conductive gel for 5G communication and its preparation, can solve problems such as inconvenient cleaning, easy damage, and failure of electronic components

Active Publication Date: 2020-07-14
SHENZHEN BORNSUN INDAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, highly integrated electronic components are prone to failure due to high temperature or vibration, and need to be repaired before they can continue to be used.
The heat-conducting materials used in existing electronic components mainly include heat-conducting silicone grease, heat-conducting gel, and heat-conducting pads, which generally have defects such as inconvenient cleaning, easy damage, and need to be replaced with new materials after maintenance, which not only reduces maintenance costs. maintenance efficiency, while increasing maintenance costs

Method used

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  • Bi-component heat-conducting gel for 5G communication and preparation method thereof
  • Bi-component heat-conducting gel for 5G communication and preparation method thereof
  • Bi-component heat-conducting gel for 5G communication and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0057] Preparation of component A:

[0058] Stir the functional polydimethylsiloxane, polymer materials containing reactive silicon-hydrogen bonds, styryl silane, and polyhedral oligomeric silsesquioxane modified by end groups evenly with a high-speed dispersant, and control the raw materials during the stirring process The temperature is 20-30°C, the stirring rate is 1000-2000r / min, and the first mixture is obtained by stirring for 20 minutes; the first mixture is poured into a planetary mixer, and then nano-fillers are added, the temperature of the raw materials is controlled at 20-30°C, and the stirring speed is 20~30r / min, stir for 12min to get the second mixture, then gradually add the inorganic functional filler into the planetary mixer in four parts, the conditions used after each addition are: raw material temperature 20~30℃; stirring speed 20 ~30r / min, stirring for 25min. After the powder is added, carry out vacuum extraction, the vacuum degree is below -0.08MPa, the...

Embodiment 1

[0064]

[0065]

[0066] Prepare component A and component B respectively according to the dosage of each raw material in the above table;

[0067] Preparation of component A:

[0068] Monovinylmethoxypolydimethylsiloxane with a molecular weight of 10000, bisvinylpolydimethylsiloxane with a molecular weight of 5000, polyacrylpolyethoxysiloxane with a molecular weight of 5000, and dihydrogen with a molecular weight of 2000 Bonded polydimethylsiloxane, molecular weight 2000 multi-hydrogen bond methoxy polydimethylsiloxane, methoxy polyhedral oligomeric silsesquioxane and styryl silane are stirred evenly with a high-speed dispersant, and the stirring process Control the temperature of the raw material at 20-30°C, stir at a rate of 1000-2000r / min, and stir for 20 minutes to obtain the first mixture; pour the first mixture into a planetary mixer, then add nano-graphene, and control the temperature of the raw material at 20-30°C , the stirring speed is 20-30r / min, and the sec...

Embodiment 2

[0073]

[0074]

[0075] According to the preparation method of Example 1, use the raw material ratio in this example to prepare component A and component B, put the prepared component A and component B into the mixing tube respectively, and use a 3D printer through a static mixer Mix the product at a certain speed according to the ratio of 1:1 and dispense glue on the aluminum plate to prepare a thermally conductive gel material. The thermally conductive gel material is tested for thermal conductivity, surface viscosity and tensile strength. The test results As shown in Table 1.

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Abstract

A bi-component heat-conducting gel for 5G communication comprises a component A and a component B, wherein the component A is prepared from organic silicon resin, filler, terminal group modified polyhedral oligomeric silsesquioxane and styryl silane; the component B is prepared from organic silicon resin, a catalyst, liquid rubber, filler, liquid crystal type epoxy resin modified organic silicon,polydiphenyl siloxane with specific functional groups at the two tail ends, nano shell-core structure powder grafted with a surface modifier and pigment. The invention further discloses a preparationmethod of the bi-component heat-conducting gel for 5G communication. The bi-component heat-conducting gel is packaged by double tubes, and the component A and the component B are mixed when the bi-component heat-conducting gel is used. The bi-component heat-conducting gel has good heat conduction performance, is convenient to repair, can be repeatedly used after repair, improves the repair efficiency and reduces the repair cost.

Description

【Technical field】 [0001] The invention relates to the field of a two-component gel material, in particular to a two-component thermally conductive gel for 5G communication with good thermal conductivity, easy repair and low cost and a preparation method thereof. 【Background technique】 [0002] With the development of 5G communication, while putting forward higher requirements for the integration of electronic components, it also requires electronic components to have higher sensitivity. However, highly integrated electronic components are prone to failure due to high temperature or vibration, and need to be repaired before they can continue to be used. The heat-conducting materials used in existing electronic components mainly include heat-conducting silicone grease, heat-conducting gel, and heat-conducting pads, which generally have defects such as inconvenient cleaning, easy damage, and need to be replaced with new materials after maintenance, which not only reduces mainte...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B26/32C09K5/14
CPCC04B26/32C09K5/14C04B2111/00465C04B2111/00008C04B2201/32C04B2201/50C04B14/024C04B14/303C04B24/2611C04B24/281C04B14/308
Inventor 唐正阳陈冠锦
Owner SHENZHEN BORNSUN INDAL
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