Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

MEMS 5G communication radio frequency antenna and manufacturing process

A technology of radio frequency antenna and manufacturing process, applied in the direction of antenna, antenna parts, antenna support/installation device, etc., can solve the problems of dust contamination, bending damage, etc., and achieve the effect of stable performance

Pending Publication Date: 2020-07-17
HANKING ELECTRONICS LIAONING
View PDF0 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Small micro-mechanical independent antennas can be fabricated on integrated circuit wafers. Due to the fragility of the micro-antenna itself, if the micro-antenna is not structurally protected, it is prone to bending damage or dust contamination

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • MEMS 5G communication radio frequency antenna and manufacturing process
  • MEMS 5G communication radio frequency antenna and manufacturing process
  • MEMS 5G communication radio frequency antenna and manufacturing process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] The present invention provides a MEMS 5G communication radio frequency antenna, which is characterized in that: the MEMS 5G communication radio frequency antenna includes a cap wafer 1, a bonding interface 2, a substrate wafer 3, a micro antenna 4, and a micro antenna anchor point 5. Metal pad 6, metal bump 7, intermediate wafer 8, electrical connection point 9, metal side wall 10, through silicon via connection 11, thin film filter 12, vacuum chamber 13;

[0023] Among them: the cap wafer 1 is used as the protective structure of the micro-antenna, the bonding interface 2 is the interface layer of the cap wafer 1, the substrate wafer 3 and the intermediate wafer 8; the substrate wafer 3 provides the base and external integration for the micro-antenna circuit; the micro-antenna anchor point 5 is the contact part of the micro-antenna 4 and the substrate wafer 3; the metal pad 6 is the metal connection line of the micro-antenna 4, which is used to connect the micro-antenna ...

Embodiment 2

[0032] The present invention provides a MEMS 5G communication radio frequency antenna, which is characterized in that: the MEMS 5G communication radio frequency antenna includes a cap wafer 1, a bonding interface 2, a substrate wafer 3, a micro antenna 4, and a micro antenna anchor point 5. Metal pad 6, metal bump 7, intermediate wafer 8, electrical connection point 9, metal side wall 10, through silicon via connection 11, thin film filter 12, vacuum chamber 13;

[0033]Among them: the cap wafer 1 is used as the protective structure of the micro-antenna, the bonding interface 2 is the interface layer of the cap wafer 1, the substrate wafer 3 and the intermediate wafer 8; the substrate wafer 3 provides the base and external integration for the micro-antenna circuit; the micro-antenna anchor point 5 is the contact part of the micro-antenna 4 and the substrate wafer 3; the metal pad 6 is the metal connection line of the micro-antenna 4, which is used to connect the micro-antenna 4...

Embodiment 3

[0041] The present invention provides a MEMS 5G communication radio frequency antenna, which is characterized in that: the MEMS 5G communication radio frequency antenna includes a cap wafer 1, a bonding interface 2, a substrate wafer 3, a micro antenna 4, and a micro antenna anchor point 5. Metal pad 6, metal bump 7, intermediate wafer 8, electrical connection point 9, metal side wall 10, through silicon via connection 11, thin film filter 12, vacuum chamber 13;

[0042] Among them: the cap wafer 1 is used as the protective structure of the micro-antenna, the bonding interface 2 is the interface layer of the cap wafer 1, the substrate wafer 3 and the intermediate wafer 8; the substrate wafer 3 provides the base and external integration for the micro-antenna circuit; the micro-antenna anchor point 5 is the contact part of the micro-antenna 4 and the substrate wafer 3; the metal pad 6 is the metal connection line of the micro-antenna 4, which is used to connect the micro-antenna ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides an MEMS 5G communication radio frequency antenna, which comprises a cap wafer, a bonding interface, a substrate wafer, a micro antenna, a micro antenna anchor point, an intermediate wafer, a thin film filter and a vacuum cavity. The substrate wafer provides a base and an external integrated circuit for the micro antenna; the micro antenna anchor point is a contact part of the micro antenna and the substrate wafer; the intermediate wafer serves as a component of a conical side wall, and an opening is formed in the intermediate wafer; and the thin film filter is a piezoelectric thin film on a substrate wafer, and the thin film filter is formed. The invention discloses a manufacturing process of the MEMS 5G communication radio frequency antenna, and the process comprises the steps: forming a metal antenna model on a semiconductor substrate plane through photoresist on an integrated circuit wafer of silicon, glass, a III-V semiconductor, GaAs, GaN and the like through an LIGA-photoetching pattern and a plane electroprint casting method; the antenna has the advantages that the micro-mechanical design and process and the antenna protection material and structure are applied from the two aspects of antenna manufacturing and antenna vulnerability protection, so that signal attenuation is not caused, and the performance is stable.

Description

technical field [0001] The invention relates to the field of miniature antennas, in particular to a MEMS 5G communication radio frequency antenna and a manufacturing process. Background technique [0002] Small micro-mechanical independent antennas can be fabricated on integrated circuit wafers. Due to the fragility of the micro-antenna itself, if the fabricated micro-antenna is not structurally protected, it is prone to bending damage or dust contamination. Contents of the invention [0003] The purpose of the present invention is to overcome the above-mentioned problems, and specifically provides a MEMS 5G communication radio frequency antenna and a manufacturing process. [0004] The present invention provides a MEMS 5G communication radio frequency antenna, which is characterized in that: the MEMS 5G communication radio frequency antenna includes a cap wafer 1, a bonding interface 2, a substrate wafer 3, a micro antenna 4, and a micro antenna anchor point 5. Metal pad...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/66H01Q1/22
CPCH01L23/66H01L2223/6677H01Q1/2283
Inventor 黄向向杨敏道格拉斯·雷·斯巴克斯关健孙斯佳
Owner HANKING ELECTRONICS LIAONING
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products