Material classification scheduling method for preventing scheduling deadlock

Abstract

The invention relates to a material classification scheduling method for preventing scheduling deadlock. The method comprises the steps of determining a to-be-scheduled material; and if the to-be-scheduled material has the process participation material placed on a bottleneck resource position, sending the information of the to-be-scheduled material to a scheduling module for scheduling, and outputting a scheduling sequence. The scheduling module is used for scheduling, and the process of outputting the scheduling sequence comprises the steps of if a wafer transfer box which is being transferred exists in a material to be scheduled, creating a moving step for the wafer transfer box with the highest priority based on a preset first wafer transfer box priority rule. According to the invention, the technical problem of scheduling calculation deadlock caused by competition for bottleneck resources when the semiconductor equipment with a stocker schedules a plurality of transmission operations and process operations at the same time is solved; the reliability of machine software operation and the equipment productivity are improved; and the experience degree of customers is further improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor equipment, in particular to a material classification scheduling method for preventing scheduling deadlock. Background technique [0002] Semiconductor vertical furnace equipment is one of the important process equipment in the pre-process of semiconductor production line. It is used for diffusion, oxidation, annealing, alloying and sintering processes in industries such as large-scale integrated circuits, discrete devices, power electronics, optoelectronic devices and optical fibers; As wafer sizes continue to increase, chipmakers can make more chips on a single wafer. Since 2000, the wafer standard in the semiconductor industry has been set at 300 mm. To simplify transportation and minimize the risk of contamination, chipmakers utilize front-opening standard wafer cassettes, also known as Foups, to handle wafers. Multiple wafers can be placed in each dust-free and ultra-clean wafer trans...

AI Technical Summary

Problems solved by technology

[0004]The semiconductor vertical furnace with stocker has an important feature: In addition to the wafer (Wafer), the wafer transfer box (Foup) is also involved in the transmission, so the wafer transfer box robot (STR) and wafer loading and unloading position (LoadLock) become the bottleneck resources of the semiconductor vertical furnace, the mobile operation of the wafer transfer box (Foup) and the mobile operation of participating in the process flow will cause scheduling deadlock due to competition for bottleneck resources, such as The wafer transfer box robot (STR) has a wafer transfer box (Foup) that needs to be moved to the wafer loading and unloading position (LoadLock), and the wafer loading and unloading position (LoadLock) has a wafer transfer box (Foup) that needs to be removed. There are wafer transfer boxes (Foup) on the box robot (STR) and the wafer loading and unloading position (LoadLock) that need to move to each other, that is, the wafer transfer box robot (STR) and the wafer loading and unloading position (LoadLock) are waiting for each other at this time The state enters into a scheduling deadlock, and the thread of the host computer will collapse in the case of a scheduling deadlock. If the machine is in an abnormal state, the materials in the processing machine are in danger of being scrapped, and the machine software must be restarted, seriously It affects the normal process flow. Therefore, it is necessary to solve the technical problem of equipment scheduling deadlock, so as to ensure material safety and improve equipment production capacity.

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