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Device for an electroless metallization of a target surface of at least one workpiece

An electroless plating, metallization technology, applied in liquid electroless plating, metal material coating process, coating and other directions, can solve the problems of wafer difference, layer thickness change, etc.

Inactive Publication Date: 2020-07-24
AP&S国际股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] With the devices known in the prior art, it is considered a disadvantage that the layer thickness of the deposited metal varies across the wafer and also varies between wafers within a batch

Method used

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  • Device for an electroless metallization of a target surface of at least one workpiece
  • Device for an electroless metallization of a target surface of at least one workpiece
  • Device for an electroless metallization of a target surface of at least one workpiece

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Embodiment Construction

[0031] figure 1 A schematic cross-sectional view of an assembly for electroless metallization according to the invention is shown.

[0032] figure 1 A longitudinal section of a container 13 is shown in which a plurality of workpieces 10 to be coated, eg semiconductor wafers, are arranged vertically in a so-called wafer carrier. In this exemplary embodiment, the first inlet 21 , the second inlet 22 and the third inlet 23 are arranged centrally in the transverse direction, along the longitudinal axis, in the bottom 15 of the container 13 . The electrolyte solution for electroless metallization arranged in the container 13 can be supplied to the container 13 via the inlets 21 , 22 , 23 . In order to achieve sufficient uniformity when coating the workpieces 10 , a diffuser 24 , designed in this example as a diffuser plate, is arranged between the inlets 21 , 22 , 23 and the part of the container 13 on which the workpieces 10 are arranged.

[0033] To this end, a diffuser plate ...

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PUM

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Abstract

The invention relates to an assembly for an electroless metallization of a target surface (11) of at least one workpiece (10), comprising a container (13) for receiving an electrolyte solution, an inlet for the electrolyte solution, arranged in the base (15) of the container (13), wherein the inlet (20) is designed as an inlet port (21) with a diffusor plate (24) comprising inlet openings (25) arranged in concentric circles, an outlet (30) which is arranged on an upper face of the container (13), and a receiving area for holding the at least one workpiece (10), wherein the diffusor plate (24)is formed as a first arrangement (31) and a second arrangement (32), which is identical to the first arrangement, of a respective plurality of inlet openings (25); the arrangements at least partly butnot completely overlap; and the inlet (20) has at least two inlet ports (21, 22).

Description

technical field [0001] The invention relates to a method according to the preamble of claim 1 for improving the homogeneity of the deposited metal layer during the electroless metallization of the target surface of at least one workpiece, for example by means of copper, nickel, palladium, silver or gold and their alloys sex device. Background technique [0002] Electroless metal deposition from electrolyte solutions is basically well known in the fields of semiconductor, solar and nanotechnology. Electroless metallization of objects, such as structured wafers, offers clear advantages over electroplating metallization in terms of electrical resistance, uniformity and consistency of deposition techniques, and achievable layer properties. Advantageously, no means are required to electrically contact the object to be coated. Furthermore, the parallel processing of several objects via batch processing is a decisive advantage for increased productivity per unit of time. Due to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/16
CPCC23C18/1628C23C18/1669C23C18/163C23C18/34C23C18/40C23C18/44
Inventor J·希尔德布兰德
Owner AP&S国际股份有限公司