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Detachable thermosetting epoxy adhesive composition and preparation method thereof

A technology of epoxy adhesives and compositions, applied in the direction of adhesives, epoxy resin adhesives, adhesive types, etc., can solve problems such as poor acid resistance, wear resistance and decreased adhesion, general acid and alkali resistance of organic silicon, etc. Achieve excellent surface dryness and reduce pollution problems

Inactive Publication Date: 2020-07-28
塔威新材料科技(上海)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The high temperature resistance of the cured formula is excellent, but the acid and alkali resistance of silicone is average, which is not suitable for the harsh acid-immersed glass processing technology, and cannot meet the requirements;
[0005] Conventional light-cured acrylic systems have severe oxygen inhibition on the surface, and the surface of the cured material is severely sticky; silicone systems are poor in acid resistance; cationic epoxy modified systems are often brittle and poor in toughness, resulting in a significant decrease in wear resistance and adhesion. For this reason, we have designed a kind of detachable thermosetting epoxy adhesive composition and its preparation method to solve the above problems

Method used

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  • Detachable thermosetting epoxy adhesive composition and preparation method thereof
  • Detachable thermosetting epoxy adhesive composition and preparation method thereof
  • Detachable thermosetting epoxy adhesive composition and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] The adhesive composition is formulated according to the following table formulation:

[0039]

[0040]

[0041] All parts are parts by weight, based on 100 parts by weight of the adhesive composition.

[0042] Specific preparation method:

[0043] S1, dissolving component D in component E, the mass concentration is 30%, to make premix;

[0044] S2, above-mentioned premix, A-C, F-H components (total 100g) are added successively in the plastic bucket that capacity is 150g, put into mixer, under 2500 rev / min, high-speed dispersion is mixed 10 minutes;

[0045] Wherein, the model of the mixer is SpeedMixer DAC 150.1FVZ.

[0046] Once prepared, test and verify it:

[0047] 1. Viscosity and Thixotropic Value Test

[0048] Refers to Brookfield viscosity (Brookfield), the test adopts ASTM D1084, and the test temperature is 25°C. The thixotropic value of the glue is obtained according to the ratio of the viscosity at 1 rpm and the viscosity at 10 rpm (25C);

[0049] 2....

Embodiment 2

[0072] In the same manner as in Example 1, the adhesive composition of Example 2 was prepared. The formulation of the adhesive composition is shown in the following table, in Example 2, the water-soluble polymer is removed, and the polymer PVP K 30 is used:

[0073]

[0074]

[0075] All parts are parts by weight, based on 99.25 parts by weight of the adhesive composition with PVP K 30 removed.

[0076] The viscosity of the obtained adhesive composition was 136,700cps / 25°C (rotational speed 1 rpm); 30,800cp / 25°C (rotational speed 10rpm);

[0077] Glue Thixotropic Index: 4.44

[0078] Screen printing test: good, no stringing or edge smearing

[0079] Glue heat curing conditions: 150C, 30 minutes.

[0080] Acid resistance test after glue curing: passed.

[0081] Surface dryness and peeling removal method after the glue is cured:

[0082] -23C / 50%RH relative humidity, surface dryness: excellent, not sticky.

[0083] - But the glass sample after screen printing 50 micr...

Embodiment 3

[0086] In the same manner as in Example 1, the adhesive composition of Example 3 was prepared. The formulation of the adhesive composition shown in the following table, Example 3 greatly reduces the amount of barium sulfate:

[0087]

[0088]

[0089] All parts are parts by weight, based on 100 parts by weight of the adhesive composition.

[0090] The viscosity of the obtained adhesive composition was 96,500cps / 25°C (rotational speed 1 rpm); 27,900cp / 25°C (rotational speed 10rpm);

[0091] Glue Thixotropic Index: 3.46

[0092] Screen printing test: poor, with obvious wire drawing or edge tailing.

[0093] It can be clearly seen that compared with the adhesive composition of Comparative Example 1, the thixotropy of the glue is significantly reduced due to the greatly reduced use amount of barium sulfate. Since barium sulfate is chemically inert, its addition can significantly reduce the crosslink density and polarity of the adhesive. When the amount of calcium sulfate...

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Abstract

The invention discloses a detachable thermosetting epoxy adhesive composition and a preparation method thereof. The detachable thermosetting epoxy adhesive composition comprises a coating composition.100 parts by weight of the coating composition mainly comprises the following materials in parts by weight: a component A prepared from 10 to 50 parts of flexible epoxy resin; a component B: 0.5-15 parts of a nano core-shell rubber epoxy resin toughening agent; a component C: 5-30 parts of an epoxy diluent; a component D: 0.2-10.0 parts of polyvinyl pyrrolidone; a component E: 0.5-4.0 parts of small molecular alcohol; a component F: 40-60 parts of precipitated barium sulfate; a component G: 0.2-4.0 parts of an organic thixotropic agent; and a component H: 0.2-5.0 parts of a thermal initiatorfor initiating epoxy cationic polymerization. The thermosetting epoxy adhesive composition provided by the invention is good in toughness, has excellent acid resistance, can be soaked in hot water torealize stripping, and can be applied to electronic processing plants on a large scale.

Description

technical field [0001] The present invention relates to the technical field of dismantling thermally curable epoxy adhesives, in particular to a dismantling thermally curable epoxy adhesive composition and a preparation method thereof. Background technique [0002] OGS (One Glass Solution) touch screen is a protective screen for electronic products made under a technology of directly forming ITO conductive film and sensor on protective glass. A piece of glass acts as both the protective glass and the touch sensor. Compared with G / G touch technology, it has the following advantages: simple structure, light weight, thinness, and good light transmittance. Because it saves a glass substrate and lamination process, it reduces the production cost and improves the product qualification rate. The OGS preparation process generally adopts a large-scale process or a small-scale process. Among them, the large-scale process has higher efficiency and is more popular for mass production. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/08C09J11/04
CPCC08K2003/3045C08L2205/03C09J11/04C09J11/08C09J163/00C08L51/04C08L39/06C08K3/30
Inventor 牟世伟柳成良范建军
Owner 塔威新材料科技(上海)有限公司
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