Unlock instant, AI-driven research and patent intelligence for your innovation.

Repairing device of Micro LED array substrate and repairing method of Micro LED array substrate

An array substrate and backplane technology, which is applied in semiconductor/solid-state device components, semiconductor/solid-state device testing/measurement, semiconductor devices, etc., can solve problems such as inability to guarantee microLED light-emitting diodes and inaccurate detection of MicroLED light-emitting diodes, and achieve The effect of cost saving and simple production process

Inactive Publication Date: 2020-07-28
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
View PDF9 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] This application relates to a repairing device for a micro LED array substrate and a repairing method for a micro LED array substrate. Ensure that all the micro LED light-emitting diodes on the micro LED array substrate are normal and free of defects; the detection of the position of the defective Micro LED light-emitting diodes is not accurate enough; The position of the defective Micro LED light-emitting diodes after transfer is located, removed and re-placed

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Repairing device of Micro LED array substrate and repairing method of Micro LED array substrate
  • Repairing device of Micro LED array substrate and repairing method of Micro LED array substrate
  • Repairing device of Micro LED array substrate and repairing method of Micro LED array substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application.

[0035]In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the ap...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a repairing device of a micro LED array substrate and a repairing method of the micro LED array substrate. The repairing device of the micro LED array substrate comprises the micro LED array substrate, test circuits, an optical measurement probe and a laser transfer head, the test circuit comprises an insulating boss layer arranged at one side of the Micro LED array substrate, and also comprises two test head electrodes which are respectively arranged at two sides of the insulating boss layer and are electrically connected with the Micro LED array substrate. The repairing device further comprises a Micro LED which is arranged on the sides, deviating from the bosses of the insulating layer, of the two test head electrodes, and the two test head electrodes are electrically connected with a positive electrode and a negative electrode of the Micro LED respectively; the beneficial effects are that: firstly, whether a defective Micro LED light emitting diode exists ona Micro LED array substrate or not is detected; and if the micro LED array substrate exists, the laser transfer head is adopted to soften the photosensitive adhesive around the defective micro LED and then replace the defective micro LED with the normal micro LED, so that the time cost is saved, the efficiency is improved, and the yield of transferring the micro LED array substrate is increased.

Description

technical field [0001] The present application relates to the display field, in particular to a repairing device for a micro LED array substrate and a repairing method for a micro LED array substrate. Background technique [0002] The application of Micro LED display devices to large-size display panels requires removing the sapphire substrate or GaAs substrate of the LED, and then transferring the micro LED to the stretch-resistant organic substrate by a mass transfer method. Selective transfer, the traditional structural transfer head is not only complicated to manufacture, but the current structural transfer head can only transfer the micro LED array substrate at a fixed position, and there are actually defects in the micro LED array substrate after detection. The position of the LED is not accurate. How to locate, remove and re-place defects on the micro LED array substrate after mass transfer is the key to improving the final yield and reducing costs. [0003] Therefo...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/15H01L21/66H01L23/544
CPCH01L27/15H01L22/34H01L22/32H01L22/22H01L22/24
Inventor 樊勇
Owner SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD