Vacuum cavity vapor chamber and manufacturing method thereof
A vacuum chamber and soaking plate technology, applied in indirect heat exchangers, lighting and heating equipment, etc., can solve the problems of single circulation mode, small capillary limit and boiling limit range, etc., to improve heat transfer efficiency, reduce temperature, Enhance the effect of heat transfer
Active Publication Date: 2020-08-04
ZHEJIANG SCI-TECH UNIV
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Problems solved by technology
However, the current vacuum vapor chamber needs to design a water storage layer. The porous material of the water storage layer is mainly sintered copper powder. The backflow of the working fluid only depends on the action of the liquid-absorbing core, and the circulation method is relatively simple. The capillary limit and boiling limit range of heat transfer Small
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[0030] The present invention will be further described below in conjunction with accompanying drawing.
[0031] like figure 1 As shown, a vacuum chamber vapor chamber includes a cover plate 1 and a bottom plate 3 fixed together, and a sealed vacuum chamber 2 is formed between the bottom plate 3 and the cover plate 1; a phase change heat transfer process is arranged in the vacuum chamber 2 Quality 11; the inner surface of the cover plate 1 is provided with an array of curved surface grooves 4 (such as image 3 (a), image 3 (b), image 3 (c) and image 3 (d) shown), and the inner surface of the cover plate is provided with a super-hydrophobic coating 5; the inner surface of the cover plate 1 is used as a condensation layer 10; the bottom plate 3 is adhered to the surface of the electronic component; the bottom plate 3 is used as a heat-receiving layer 7; the inner surface of the bottom plate 3 A porous water-absorbing medium 6 is provided, and the area where the porous wate...
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Abstract
The invention discloses a vacuum cavity vapor chamber and a manufacturing method thereof. The thermal cycle efficiency of an existing vacuum vapor chamber needs to be improved. A phase change heat transfer working medium is arranged in a vacuum cavity of the vacuum cavity vapor chamber, array type curved surface grooves and super-hydrophobic coatings are arranged on the inner surface of cover plates, a porous water absorption medium is arranged on the inner surface of a bottom plate, the manufacturing method comprises the following steps that the porous water absorption medium is formed on thebottom plate; the array type curved surface grooves with selected groove opening shapes are formed in the inner surface of each cover plate, then the inner surface of each cover plate is coated withthe super-hydrophobic coatings with different geometrical properties and distribution characteristics, and the phase change heat transfer working medium is selected for carrying out a liquid drop condensation test on the inner surface of each cover plate; the influence of the super-hydrophobic coatings on parameter boundary among dynamic behaviors in a combined induced self-propulsion process to obtain the energy distribution rule of liquid drops, and the cover plates coated with the super-hydrophobic coatings and meeting the requirement is selected to be fixed to the bottom plate, and vacuumcavities between the bottom plate and the cover plates are prepared. According to the vacuum cavity vapor chamber and the manufacturing method thereof, the overall heat transfer efficiency of the vacuum cavity vapor chamber is improved.
Description
technical field [0001] The invention relates to a heat dissipation technology for electronic products, in particular to a novel vacuum chamber soaking plate and a manufacturing method thereof. Background technique [0002] With the rapid development of modern electronic technology, all kinds of electronic components are developing in the direction of high efficiency and miniaturization. The internal space of electronic equipment is getting smaller and smaller, and the distribution is getting denser, resulting in concentrated internal heat generation and high heat flux density. . High calorific value will lead to performance degradation of electronic components, and when the temperature exceeds a certain range, components may even fail. High-density heat flow will form "hot spots" on the surface of components, which not only affects their performance, but also affects the reliability of the entire system. According to data, when the CPU operating temperature exceeds the rate...
Claims
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Login to View More IPC IPC(8): F28D15/04F28D15/06
CPCF28D15/043F28D15/06
Inventor 胡建新潘定一赵秋茁
Owner ZHEJIANG SCI-TECH UNIV