A kind of mems palladium alloy probe test method and its probe loading method

A test method, the technology of palladium alloy, applied in the direction of measuring device, testing material strength by applying stable bending force, testing material strength by applying stable tension/pressure, etc., can solve the problem of heat dissipation that is difficult to solve, and no palladium alloy probe has been found. Needle test equipment, technical difficulty and other issues
CN111504767BActive Publication Date: 2020-11-03MAXONE SEMICON CO LTD
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Patents(China)
Current Assignee / Owner
MAXONE SEMICON CO LTD
Publication Date
2020-11-03

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Abstract

The invention discloses a MEMS palladium alloy probe testing method and a probe loading method thereof, which belong to the field of IC manufacturing industry, and specifically relate to a device, method and related key technology for performance testing of a palladium alloy probe in a MEMS probe card; The method first loads the probes to be tested: including the loading method of the probes to be tested when testing the tensile properties and the loading method of the probes to be tested when testing the bending properties; then setting the test temperature and humidity: monitoring by sensors, sprayers, heaters and The fan cooperates to realize the adjustment of temperature and humidity. During the adjustment process, the disturbance body rotates under the action of the electromagnetic pole to ensure that the temperature and humidity in the test environment are uniform; in the final test, only the symmetrical bending test structure is required to achieve multiple different parameters. Test the tensile performance and bending performance of the probe to be tested; the method can test the tensile performance and bending performance of the probe on the MEMS probe card.
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Description

technical field

[0001] The invention discloses a MEMS palladium alloy probe testing method and a probe loading method thereof, which belong to the field of IC manufacturing industry, and specifically relate to a device, method and related key technologies for performance testing of palladium alloy probes in MEMS probe cards. Background technique

[0002] The probe card is a very important technology in the chip manufacturing process. Before the chip is packaged, the probes on the probe card directly contact the pads or bumps on the chip to lead out the chip signal, and then cooperate with peripheral testing instruments and Software control realizes automatic measurement, and then screens out defective products to ensure product yield.

[0003] With the development of micro-electromechanical system (MEMS) technology, the size of the chip is getting smaller and smaller, reaching the order of millimeters, and the degree of integration inside the chip is getting higher and highe...

Claims

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