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Manufacturing process of high-precision flexible printed board (FPC)

A flexible circuit board and manufacturing process technology, applied in printed circuit manufacturing, printed circuit, printed circuit liquid treatment, etc., can solve problems affecting the uniformity and accuracy of copper plating thickness, affecting FPC performance, etc., to achieve smooth copper layer, The effect of improving accuracy, improving accuracy

Pending Publication Date: 2020-08-07
苏州市杰煜科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Generally, when FPC is drilled, high-speed rotation will generate high temperature, which will denature the FPC sheet and adhere to the inner wall of the hole, which greatly affects the uniformity and accuracy of the copper plating thickness in the subsequent hole.
At the same time, when etching the copper wire on the surface of the FPC, because the etching ability of the etching solution changes with the depth, the cross section of the copper wire is not a rectangle, but a trapezoid, which will also affect the performance of the FPC

Method used

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  • Manufacturing process of high-precision flexible printed board (FPC)

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] refer to figure 1 As shown, this embodiment discloses a high-precision FPC flexible circuit board manufacturing process, including the following steps:

[0034] S1, remove glue residue:

[0035] a. Soak the FPC after punching in the leavening agent for 15-20 minutes, and the soaking temperature is 35-40°C;

[0036] b. After taking out the FPC after soaking, rinse it with cleaning solution for 2 to 4 times, and dry it with cool wind;

[0037] c. Put the FPC into the strong alkali solution added with potassium permanganate solution, soak for 16-20 minutes, the soaking temperature is 120-140°C, the pH value of the solution is 12-14, and the concentration of potassium permanganate is 28 ~30g / L;

[0038] d. After taking out the FPC, soak it in the cleaning solution, and use sound waves to vibrate. The soaking time is 30-45s, and the sound wave frequency is 4000-6000Hz;

[0039] S2, electroless copper:

[0040] e. Put the FPC after sonic cleaning into a mixed solution of...

Embodiment 2

[0046] This embodiment discloses a high-precision FPC flexible circuit board manufacturing process, including the following steps:

[0047] S1, remove glue residue:

[0048] a. Soak the FPC after punching in the leavening agent for 17.5 minutes, and the soaking temperature is 37.5°C;

[0049] b. After taking out the FPC after soaking, rinse it with cleaning solution for 2 to 4 times, and dry it with cool wind;

[0050] c. Put the FPC into the strong alkali solution added with potassium permanganate solution, soak for 16-20 minutes, the soaking temperature is 120-140°C, the pH value of the solution is 12-14, and the concentration of potassium permanganate is 28 ~30g / L;

[0051] d. After taking out the FPC, soak it in the cleaning solution, and use sound waves to vibrate. The soaking time is 30-45s, and the sound wave frequency is 4000-6000Hz;

[0052] S2, electroless copper:

[0053] e. Put the FPC after sonic cleaning into a mixed solution of copper sulfate, sodium hydroxi...

Embodiment 3

[0059] This embodiment discloses a high-precision FPC flexible circuit board manufacturing process, including the following steps:

[0060] S1, remove glue residue:

[0061] a. Soak the FPC after punching in the leavening agent for 17.5 minutes, and the soaking temperature is 37.5°C;

[0062] b. After taking out the FPC after soaking, rinse it with cleaning solution for 3 times, and dry it with cool wind;

[0063] c. Put the FPC into the strong alkali solution added with potassium permanganate solution, soak for 16-20 minutes, the soaking temperature is 120-140°C, the pH value of the solution is 12-14, and the concentration of potassium permanganate is 28 ~30g / L;

[0064] d. After taking out the FPC, soak it in the cleaning solution, and use sound waves to vibrate. The soaking time is 30-45s, and the sound wave frequency is 4000-6000Hz;

[0065] S2, electroless copper:

[0066] e. Put the FPC after sonic cleaning into a mixed solution of copper sulfate, sodium hydroxide, f...

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Abstract

The invention discloses a manufacturing process of a high-precision flexible printed circuit (FPC). The manufacturing process comprises the following steps: S1, removing glue residues; S2, carrying out chemical copper deposition; S3, sequentially carrying out copper electroplating, chemical cleaning, dry film pasting, two-side exposure, development and etching; S4, after etching is completed, putting FPC into a mixed solution of H2SO4 and H2O2 again, soaking for 3 to 4.5 minutes while vibrating by using sound waves, wherein the soaking temperature is 30-38 DEG C, the concentration of H2SO4 is60-70 g / L, the concentration of H2O2 is 40-50 g / L, and the frequency of the sound waves is 200-300 Hz; and S5, after cleaning is conducted through a cleaning fluid, sequentially carrying out film removing, chemical cleaning, protective film pasting, laminating and reinforcing, and finally carrying out subsequent treatment to complete manufacturing. According to the invention, the thickness and thewidth of a copper layer can be accurately controlled, the surface smoothness is good, and the precision of the FPC is greatly improved.

Description

technical field [0001] The invention relates to a manufacturing process, in particular to a manufacturing process of a high-precision FPC flexible circuit board. Background technique [0002] Due to its superior performance, flexible printed circuit (FPC) is more and more applied to various electronic products. In order to ensure the normal use of electronic products, the thickness and width of the copper wires on the FPC have strict requirements. Generally, when FPC is drilled, high-speed rotation will generate high temperature, which will denature the FPC sheet and adhere to the inner wall of the hole, which greatly affects the uniformity and accuracy of the copper plating thickness in the subsequent hole. At the same time, when etching the copper wire on the surface of the FPC, because the etching ability of the etchant changes with the depth, the cross section of the copper wire is not a rectangle, but a trapezoid, which will also affect the performance of the FPC. Co...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/22
CPCH05K3/0055H05K3/0085H05K3/22Y02P10/20
Inventor 奚杰
Owner 苏州市杰煜科技有限公司
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