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Resin composition and cured material of same, adhesive, semiconductor device, and electronic component

A technology of resin composition and cured product, applied in the field of electronic parts, can solve the problems of shortened pot life and difficult UV curability of thiol-based adhesives, and achieve the effect of high reliability

Active Publication Date: 2020-08-11
NAMICS CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is very difficult to impart UV curability to thiol-based adhesives
This is due to the fact that the curing reaction between UV-curable acrylate resins and thiol resins is easier than the curing reaction between resins other than acrylate resins (such as epoxy resins) and thiol resins, so the pot life is shortened to Level that is practically unusable

Method used

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  • Resin composition and cured material of same, adhesive, semiconductor device, and electronic component
  • Resin composition and cured material of same, adhesive, semiconductor device, and electronic component
  • Resin composition and cured material of same, adhesive, semiconductor device, and electronic component

Examples

Experimental program
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Effect test

preparation example Construction

[0035] It is preferable that (A) component has the viscosity of 0.02-20 Pa*s from a viewpoint of the preparation of a resin composition, and dispensability.

[0036] Commercially available products of the (A) component include polyester acrylate (product name: M7100) manufactured by Toagosei Co., Ltd., dimethylol-tricyclodecane diacrylate (product name: LIGHT ACRYLATE DCP-A) and polyester acrylate (product name: EBECRYL 810) manufactured by DAICEL-ALLNEX Corporation. As (A) component, independent components may be used, and 2 or more types of components may be used together.

[0037] The polyfunctional thiol resin which is (B) component provides elasticity and moisture resistance to a resin composition. (B) The component will not be specifically limited if it has 2 or more functional groups. However, it is preferable that (B) component has a structure which does not have an ester bond in a molecule|numerator from a moisture resistant viewpoint. As (B) component, the glycolu...

Embodiment 1～9

[0104] [Examples 1-9, Comparative Examples 1-4]

[0105]According to the formulations shown in Tables 1 and 2, an adhesive containing a resin composition was prepared using a three-roll mill.

[0106] 〔Shear strength〕

[0107] Adhesives are printed on SUS substrates. The coating size was set to 2 mmφ. A 3.2 mm x 1.6 mm x 0.45 mm thick alumina chip was placed on the printed adhesive. Regarding the curing conditions, the UV irradiation amount is set to 2000mJ / cm 2 After (UV wavelength: 365nm, LED lamp), it was set to 80° C. / 60 minutes in a blast dryer.

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PUM

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Abstract

Provided are a resin composition and an adhesive including the same, a cured material of the resin composition and a semiconductor device including the same, and an electronic component including thesemiconductor device, the resin composition being photocurable and heat curable and capable of low-temperature curing, and having high moisture-resistant reliability (particularly shear strength aftermoisture resistance testing) after curing. A resin composition characterized by including (A) a polyfunctional (meth)acrylate resin, (B) a polyfunctional thiol resin, and (C) a calcium carbonate filler having a purity of 99% or higher. The (B) component preferably includes a polyfunctional thiol resin not having an ester bond in the molecule thereof. More preferably, the resin composition furtherincludes talc.

Description

technical field [0001] The present invention relates to a resin composition cured by light and heat, a cured product thereof, an adhesive, a semiconductor device, and an electronic component. More specifically, the resin composition can be temporarily fixed by, for example, light irradiation, and can be fully cured by heating. Background technique [0002] Adhesives of a type that are temporarily fixed by ultraviolet (UV) irradiation and are fully cured by heat are used in various fields (for example, refer to Patent Documents 1 and 2). Such adhesives are often utilized exclusively in image sensor modules. In the manufacturing process of the image sensor module, if the lens used in the image sensor module becomes high temperature, it will deteriorate. Therefore, adhesives and sealing materials used in the manufacture of image sensor modules are required to be curable at low temperatures. However, it is very difficult to impart UV curability to thiol-based adhesives. This...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G75/045C09J181/02C08K3/26C08L81/02
CPCC08L81/02C08K3/26C09J181/02C08G75/045H01L23/295H01L23/564C09J133/14C08K2003/265C09J4/00C09J4/06C08K5/378C08F2/48C08L41/00C08F290/141C08F222/102C08L67/07C08L101/08C08L35/02C08G75/0222C08K3/34C08L33/10
Inventor 阿部信幸岩谷一希
Owner NAMICS CORPORATION