A kind of m12 large size silicon wafer cutting process
A silicon wafer cutting and large-size technology, which is applied in the field of M12 large-size silicon wafer cutting technology, can solve the problems of decreased production efficiency, increased difficulty of silicon wafer cutting end, and increased cost, so as to reduce the cost of slicing and reduce the abnormality of chipping Bad, reduce the effect of changing the number of times
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Embodiment 1
[0030] An M12 large-size silicon wafer cutting process, comprising the following steps:
[0031] S1: sticking rod: select the qualified silicon rod size 210*210mm, use the curing agent to bond the silicon rod to the workpiece board for curing, the curing time is 3h, and the room temperature is 23-28℃;
[0032] S2: Loading the rod: Use the feeding car to load the silicon rod onto the worktable clamping guide rail of the cutting machine to ensure that the silicon rod is properly clamped in the worktable clamping guide rail;
[0033] S3: Add cutting fluid: The cutting fluid is a mixture of coolant and pure water. Take the cutting fluid and stir it evenly, and add it to the liquid supply cylinder of the multi-wire cutting machine for use. The volume ratio of coolant to pure water is 1.5L: 250L;
[0034] S4: Preheating before cutting: Turn on the cutting fluid flow rate of 165L / min, set the diamond wire running speed to 1800m / min, perform a reciprocating high-speed wire cutting he...
Embodiment 2
[0042] An M12 large-size silicon wafer cutting process, comprising the following steps:
[0043] S1: sticking rod: select qualified silicon rod size 210*210mm, silicon rod length 650mm, use curing agent to bond the silicon rod to the workpiece board for curing, curing time is 3h, room temperature is 23 ~ 28 ℃;
[0044] S2: Loading the rod: Use the feeding car to load the silicon rod onto the worktable clamping guide rail of the cutting machine to ensure that the silicon rod is properly clamped in the worktable clamping guide rail;
[0045] S3: Add cutting fluid: The cutting fluid is a mixture of coolant and pure water. Take the cutting fluid and stir it evenly, and add it to the liquid supply cylinder of the multi-wire cutting machine for use. The volume ratio of coolant to pure water is 2.0L: 300L;
[0046] S4: Preheating before cutting: Turn on the cutting fluid flow rate of 180L / min, set the diamond wire running speed to 2100m / min, perform a reciprocating high-speed wire c...
Embodiment 3
[0055] An M12 large-size silicon wafer cutting process, comprising the following steps:
[0056] S1: sticking rod: select qualified silicon rod size 210*210mm, silicon rod length 650mm, use curing agent to bond the silicon rod to the workpiece board for curing, curing time is 3h, room temperature is 23 ~ 28 ℃;
[0057] S2: Loading the rod: Use the feeding car to load the silicon rod onto the worktable clamping guide rail of the cutting machine to ensure that the silicon rod is properly clamped in the worktable clamping guide rail;
[0058] S3: Add cutting fluid: The cutting fluid is a mixture of coolant and pure water. Take the cutting fluid and stir it evenly, and add it to the liquid supply cylinder of the multi-wire cutting machine for use. The volume ratio of coolant to pure water is 2.0L: 350L;
[0059] S4: Preheating before cutting: Turn on the cutting fluid flow rate of 170L / min, set the diamond wire running speed to 2000m / min, perform a reciprocating high-speed wire c...
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