PCB BGA area zero-distance through hole design method

A design method and zero-distance technology, applied in the directions of printed circuit components, electrical connection printed components, electrical components, etc., can solve the problems of high cost of resin plug holes, low application degree, yellow false copper exposure, etc. The effect of yield and quality, strong practicability, and wide application

Inactive Publication Date: 2016-01-27
LANGCHAO ELECTRONIC INFORMATION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The improvement methods in the industry mainly include changing to one-sided window opening, reducing the ink in the hole, and controlling the fluidity of the ink, but this plugging hole will produce yellow false copper exposure, which will af

Method used

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  • PCB BGA area zero-distance through hole design method
  • PCB BGA area zero-distance through hole design method
  • PCB BGA area zero-distance through hole design method

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0022] Example one:

[0023] In the spherical contact display BGA area of ​​the PCB board, open a number of via holes as needed. A pad is provided on the outside of the via hole. The pad is offset by a certain distance from the via hole, and a cover oil ring is set within the offset distance. The oil cover ring is a concave ring surrounding the outside of the via hole, and the outside of the oil cover ring is in contact with the edge of the pad.

[0024] The distance between the via hole and the pad is 3 mils, that is, the ring diameter of the oil cover ring is 3 mils.

[0025] After the cover oil ring is opened, ink plugging is carried out through the hole, and the ink plugging section is cured at 65℃×90min+85℃×150min+100℃×60min+120℃×40min+150℃×60min.

[0026] PCBBGA area via holes directly use ink plug holes, especially in the case of multiple layers and thick PCB boards, the risk of oil explosion on the pad is extremely high, which affects the welding abnormalities in the later PCB...

Example Embodiment

[0028] Embodiment two:

[0029] The ring diameter distance of the oil cover ring between the via hole and the pad is designed to be 4 mil, and the other steps follow the first embodiment.

[0030] Since the ink flow between the via and the pad can be up to 4mil, the ring diameter of the oil cover ring is expanded to 4mil here to ensure that the ink plug hole is continued to be used during the PCB manufacturing process, and the BGA area via hole appears Exuding explosive oil, as attached image 3 As shown, the presence of the increased oil cover ring will also block the explosion oil, making the explosion oil unable to flow to the pad, ensuring that the pad is clean and pollution-free, thereby effectively preventing poor soldering of the pad.

[0031] After using the design of the present invention, when inspecting again, there is no phenomenon of pads on the oil explosion, and the use effect is ideal; the test verification shows that the problem of the pads on the PCBBGA via hole ex...

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PUM

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Abstract

The invention discloses a PCB BGA area zero-distance through hole design method. The design method includes that a BGA area is displayed on the spherical contact of a PCB board, a plurality of through holes are arranged as needed, a pad is arranged at the outer sides of the through holes and deviates from the through holes at a certain distance, and an oil cover ring is arranged in the deviation distance, the oil cover ring is a recess ring surrounding the outer sides of the through holes, and the outer sides of the oil cover ring is contacted with the edge of the pad. Compared with the prior art, the PCB BGA area zero-distance through hole design method can prevent the pad from being subjected to oil explosion through the BGA through holes and effectively improves the production yield rate and quality of the PCB board by modifying the PCB design and additionally arranging the oil cover ring; and through the modification of the PCB design, printing ink plug holes can be continuously used, the cost is effectively saved, the application is wide, the practicality is high, and the popularization is easy.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a design method with strong practicability and zero-distance via holes in the PCBBGA area. Background technique [0002] As the carrier of electronic circuits, PCB generally exists in the hardware erection system of servers. In the design process of multi-layer PCB, in order to ensure the interconnection of inner and outer layers, there are ubiquitous via holes. During the PCB manufacturing process, the via holes need to be soldered and plugged. . At present, ink plugging is generally used as a plugging method. This plugging method is simple, convenient, and cheap, and can meet various applications. [0003] For PCBs with BGAs, the traditional design method in the industry in the BGA area is to directly connect the vias to the pads to ensure the continuity of the inner and outer circuits. However, in the process of PCB production, if the hole is plugged with ink,...

Claims

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Application Information

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IPC IPC(8): H05K1/11
CPCH05K1/116H05K2201/0949
Inventor 信召建史书汉陈立卫
Owner LANGCHAO ELECTRONIC INFORMATION IND CO LTD
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