A reconfigurable chip antenna based on tsv three-dimensional packaging and its reconfiguration method

Abstract

The invention discloses a reconfigurable chip antenna based on TSV three-dimensional packaging and its reconfiguration method. The antenna includes a cross radiation layer, a metal cross slot layer, a reconfigurable feed network layer, and bias and control from top to bottom. Layer, the first bias line of the silicon hole process diode in the cross radiation layer is connected to the bias and control layer through the metal cross gap layer and the via hole on the reconfigurable feed network layer; the cross radiation layer is used for antenna radiation, embedded To the metal cross slot layer below; the metal cross slot layer is used to form two reconfigurable variables of frequency and polarization; the reconfigurable feed network layer is used to feed the bivariate reconfigurable antenna; the bias and control layer Used to arrange bias circuit and control circuit. Methods The frequency and polarization reconfiguration of the antenna is realized by controlling the conduction or cut-off of the S-PIN on the slits at different positions and the corresponding S-PIN of the reconfigurable feed network. The invention reduces chip power consumption and reduces invalid reflection of radio frequency signals.

Description

technical field [0001] The invention relates to antenna technology, in particular to a reconfigurable chip antenna based on TSV three-dimensional packaging and a reconfiguration method thereof. Background technique [0002] Through Silicon Via technology (Through Silicon Via, TSV) technology is a high-density packaging technology, which is gradually replacing the current relatively mature wire bonding technology, and is considered to be the fourth generation packaging technology. TSV technology realizes the vertical electrical interconnection of through-silicon holes by filling conductive substances such as copper, tungsten, and polysilicon. TSV technology can reduce interconnection length through vertical interconnection, reduce signal delay, reduce capacitance / inductance, realize low power consumption between chips, high-speed communication, increase broadband and realize miniaturization of device integration. [0003] Antenna is one of the core components of electronic s...

AI Technical Summary

Problems solved by technology

However, there are disadvantages such as single refactoring variables, high power consumption, and high application complexity.

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