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A kind of polyimide film with low thermal expansion coefficient and preparation method thereof

A polyimide film, low thermal expansion coefficient technology, applied in the field of optical materials, can solve the problems of reducing the thermal thermal expansion coefficient, damage the mechanical properties of the film, etc., to achieve the effect of reducing the thermal expansion coefficient, good bonding performance, and not easy to crack

Active Publication Date: 2022-05-20
ZHEJIANG OCAS NEW MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although both polyimides achieve the purpose of reducing the coefficient of thermal expansion, they also compromise the mechanical properties of the film.

Method used

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  • A kind of polyimide film with low thermal expansion coefficient and preparation method thereof
  • A kind of polyimide film with low thermal expansion coefficient and preparation method thereof
  • A kind of polyimide film with low thermal expansion coefficient and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] A kind of polyimide film of low coefficient of thermal expansion, its preparation method comprises:

[0034] Preparation of S1, diphenol monomer:

[0035] Under nitrogen protection, 4.4424g (10mmol) 4,4'-(hexafluoroisopropylene) diphthalic anhydride (hereinafter referred to as 6FDA), 3.5426g (20mmol) 4-amino-2-trifluoromethylphenol, Add 32ml of anhydrous N-methylpyrrolidone (hereinafter referred to as NMP) into the reaction flask, stir and react at room temperature for 8 hours, after removing the solvent, the diphenol monomer is prepared, and its structural formula is as follows:

[0036]

[0037] S2, the preparation of polyester amic acid:

[0038] Under nitrogen protection, 7.9848g (10mmol) of the above-mentioned diphenol monomer, 2.0302g (10mmol) of terephthaloyl chloride (hereinafter referred to as CC44), and 38ml of anhydrous N-methylpyrrolidone were added to the reaction flask at room temperature. Stirred and reacted for 8 hours to obtain the polyester amic a...

Embodiment 2

[0043] A kind of polyimide film of low thermal expansion coefficient, the preparation method of this film is identical with embodiment 1, except in the preparation of diphenol monomer, 4.4424g (10mmol) 6FDA, 3.5426g (20mmol) 4-amino- 3-Trifluoromethylphenol and 32ml of anhydrous NMP were added into the reaction flask for reaction, and the relevant performance test results of the polyimide film thus obtained are also shown in Table 1.

Embodiment 3

[0045]A kind of polyimide film of low thermal expansion coefficient, the preparation method of this film is identical with embodiment 1, except in the preparation of diphenol monomer, 4.4424g (10mmol) 6FDA, 3.5426g (20mmol) 2-amino- 4-Trifluoromethylphenol and 32ml of anhydrous NMP were added into the reaction flask for reaction, and the relevant performance test results of the polyimide film thus obtained are also shown in Table 1.

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Abstract

The invention proposes a polyimide film with low thermal expansion coefficient and a preparation method thereof. By introducing structural units such as ester bonds into the molecular structure, the polyimide film with low thermal expansion coefficient and high mechanical performance is obtained.

Description

technical field [0001] The invention relates to the technical field of optical materials, in particular to a polyimide film with low thermal expansion coefficient and a preparation method thereof. Background technique [0002] Polyimide is the most important variety of aromatic heterocyclic polymers developed in the past half century, and it is also one of the organic polymer materials with the best comprehensive performance. It has been widely used, and the application is more and more extensive, and the demand is increasing. Frequently, polyimide is used as a base film on flexible circuit boards. When used on flexible circuit boards, the dimensional stability of the film is highly required, and the film material needs to match the degree of change with the temperature of the copper foil. The coefficient of thermal expansion is an important parameter to investigate the dimensional stability of the film. Compared with inorganic materials, polymer materials have a large di...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L79/08C08J5/18C08G73/16
CPCC08J5/18C08G73/16C08J2379/08
Inventor 李南文许辉张群
Owner ZHEJIANG OCAS NEW MATERIALS CO LTD
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