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Ceramic packaging shell and packaging shell mounting structure

A technology of ceramic packaging and casing, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of interconnection and microwave packaging casings that cannot be high-density, and achieve improved wiring density, excellent microwave performance, and high components. distribution effect

Active Publication Date: 2020-08-28
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a ceramic packaging shell, which aims to solve the technical problem that the existing microwave packaging shell cannot perform high-density interconnection

Method used

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  • Ceramic packaging shell and packaging shell mounting structure
  • Ceramic packaging shell and packaging shell mounting structure
  • Ceramic packaging shell and packaging shell mounting structure

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Embodiment Construction

[0034] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0035] Please also refer to Figure 1 to Figure 5 , the ceramic packaging shell provided by the present invention will now be described. The ceramic packaging shell includes a ceramic base 1, a ceramic insulator 2, a cover plate 3 and a pad structure; the ceramic base 1 is a multi-layer structure, and the ceramic base 1 is provided with a cavity 5 with an upward opening; the ceramic insulator 2 is arranged on a ceramic On the substrate 1, a radio frequency transmission structure 6 is formed on the upper part of the ceramic insulator 2, and the radio frequency tran...

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Abstract

The invention provides a ceramic packaging shell, and belongs to the technical field of chip packaging. The ceramic packaging shell comprises a ceramic substrate, a ceramic insulator, a cover plate and a bonding pad structure, wherein the ceramic substrate is of a multi-layer structure and is provided with a cavity, the ceramic insulator is arranged on the ceramic substrate, a radio frequency transmission structure penetrating through the side wall of the cavity is arranged at the upper portion of the ceramic insulator, the cover plate hermetically covers the cavity, and the bonding pad structure is arranged at the bottom of the ceramic substrate. According to the ceramic packaging shell provided by the invention, the packaging shell has excellent microwave performance, high-density wiring, high-integration component distribution and more leading-out terminals, and can perform high-density interconnection. The invention further provides a packaging shell mounting structure, wherein a circuit board is provided with a first step structure with the upper surface flush with the upper surface of the ceramic insulator, the first step structure is provided with a bonding structure used for being connected with the radio frequency transmission structure, and the circuit board is provided with a circuit board bonding pad structure welded to the bonding pad structure, so that the packaging shell mounting structure is convenient to install with the ceramic packaging shell while impedance matching is ensured.

Description

technical field [0001] The invention belongs to the technical field of chip packaging, and more specifically relates to a ceramic package shell and a package shell installation structure. Background technique [0002] With the continuous development of microwave semiconductor technology, the operating frequency of the device is getting higher and higher, which requires the packaging shell to adapt to the packaging of higher frequency devices and smaller standing waves. The metal cavity embedded ceramic insulator structure shell is suitable for packaging more It is an ideal packaging shell form for high-frequency devices. It can seal one or more microwave and millimeter-wave semiconductor chips in a separate box, and realize the interconnection of microwave signals with external circuits through ceramic insulators as input and output terminals. Because the entire shell It is a fully sealed structure, which isolates the erosion of the chip by the external environment, and the ...

Claims

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Application Information

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IPC IPC(8): H01L25/18H01L23/31H01L23/488
CPCH01L25/18H01L23/3128H01L24/14H01L2224/1413H01L2224/48091H01L2924/00014H01L2224/48227H01L2924/15311H01L2924/19107H01L2924/171H01L2924/16195H01L24/48H01L2924/165H01L2924/3011H01L2924/20271H01L2924/3512H01L23/66H01L2223/6611H01L2223/6633H01L2223/6655H01L23/053H01L23/49838H01L23/15H01L23/49816H01L2224/45099H01L23/13H01L23/49822H01L23/49833H01L25/0655H01L2223/6627H01L2224/48155H01L2224/48225H01L2924/16251H01L2924/1631H01L2924/1632
Inventor 杨振涛
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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