The application provides an
optical module, which comprises a circuit board.
Laser driving chips on driving
chip bonding pads, flexible board bonding pads, and differential
signal wires for connectingthe flexible board bonding pads with the driving
chip bonding pads are arranged on a top
signal layer of the circuit board. Ground holes for differential
signal returning are formed around each groupof flexible board bonding pads, driving
chip bonding pads, and differential signal wires on the top signal layer, and a first grounding layer and a second grounding layer in the circuit board, so that a signal return path is reduced. Moreover,
metal layers are laid in forward projection areas of the flexible board bonding pads and hollow areas are formed in the forward projection areas of the driving chip bonding pads; and
metal layers are laid in the forward projection areas of the driving chip bonding pads on the second grounding layer so as to provide a signal
backflow ground. On the basisof the design, the high-frequency performance coherence resistance can be improved and thus the impedance continuity between the
laser driving chip and the flexible circuit board in working of the
optical module is improved.