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A kind of conformal preparation method and product of thick film heat flow meter

A heat flow meter and thick film technology, which is applied in the field of conformal preparation of thick film heat flow meters, can solve the problems that thin film sensors are not as reliable as thick film sensors, cannot achieve accurate measurement of heat flow on the surface of heat sources, and lack surface conformal sensor preparation technology. , to achieve the effect of no mask, good economic adaptability, and increased thickness

Active Publication Date: 2021-04-30
HUAZHONG UNIV OF SCI & TECH
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

In terms of technology, magnetron sputtering and electron beam etching are mainly used. The equipment cost is high, the process is complicated, and the processing cycle is long; The object to be measured is separated, and the heat flow will be lost during the heat flow through the air to the surface of the heat flow meter, and the accurate measurement of the heat flow on the surface of the heat source cannot be realized.
[0005] However, for some application scenarios that focus on reliability, the reliability of thin film sensors in high temperature and high pressure corrosion environments is far inferior to that of thick film sensors
Moreover, the current sensor preparation technology is mainly based on planar technology, and there is a lack of preparation technology for curved surface conformal sensors.

Method used

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  • A kind of conformal preparation method and product of thick film heat flow meter
  • A kind of conformal preparation method and product of thick film heat flow meter

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preparation example Construction

[0031] The application of the present invention provides a method for preparing a heat flow meter and the prepared thick film heat flow meter, wherein the preparation method is as follows:

[0032] Step 1: use nanosecond pulse laser etching to form grooves with the same shape as the thermal resistance layer 6 on the substrate 7, then clean and dry with deionized water.

[0033] The second step: use a micro-pen to directly write the polyamic acid solution, and heat-cure to form a polyimide layer to fill the grooves formed by laser etching in the previous step to form a thermal resistance layer 6 . The thermal resistance layer fills the entire groove and is embedded in the upper surface of the substrate, and the thermal resistance layer is flush with the upper surface of the substrate.

[0034] Step 3: Prepare the insulating layer 5 on the substrate 7 and the thermal resistance layer 6 by directly writing the polyamic acid solution with a micro-pen, and thermally curing to form ...

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Abstract

The invention discloses a conformal preparation method for a thick-film heat flow meter, which belongs to the field of thick-film sensors, comprising: S1 prepares a groove at a part of a substrate to be measured, the groove is used to provide a place for preparing a thermal resistance layer, and S2 prepares a groove in the groove The thermal resistance layer is prepared in S3, the insulating layer is prepared in S3, the thermoelectric positive electrode, thermoelectric negative electrode and thermal junction are prepared on the insulating layer in S4 to form a thermopile pattern, and the surface protection layer is prepared in S5, which is used to improve the stability of the heat flow meter. In the present invention, laser micro cladding technology is used to conveniently and efficiently direct write and micro cladding of electronic paste, so as to prepare heat flow meters on the surface of various substrates, which has the advantages of simple process, no need for masks, short manufacturing cycle and low cost The advantages.

Description

technical field [0001] The invention belongs to the field of hardware preparation of thick film sensors, in particular, relates to a conformal preparation method and products of thick film heat flow meters. Background technique [0002] Thermology originated from the exploration of hot and cold phenomena by human beings, and heat transfer process, as an important branch of thermal research, commonly exists in industrial production and daily life. Among them, heat flow can directly reflect the rate and energy density of heat energy transfer, and can directly affect the thermal stress and strain of structural materials during service. Therefore, the research on the theory and sensor technology of heat flow measurement has attracted more and more attention. Taking the field of aerospace manufacturing as an example, aircraft shells, fuel tanks, control systems, mechanical connections, and engine turbine blades are often subjected to harsh working environments of high temperature...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01K17/00
CPCG01K17/00
Inventor 曾晓雁欧阳韬源凌怡辰吕铭王月月吴烈鑫
Owner HUAZHONG UNIV OF SCI & TECH
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