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Method for processing numerical aperture variable micro lens through space shaping laser

A numerical aperture and space shaping technology, applied in the field of laser applications, can solve the problems of low processing efficiency, high processing difficulty, and poor shape controllability of microlenses, and achieve the effect of realizing large-area consistent processing and taking into account processing quality.

Active Publication Date: 2020-09-18
BEIJING INSTITUTE OF TECHNOLOGYGY
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problems of low processing efficiency, high processing difficulty, and poor shape controllability of existing microlenses, and provide a method for spatial shaping laser-assisted etching and processing of variable numerical aperture microlenses; the method adopts spatial The Bessel beam obtained by phase shaping can be used to modify the glass, and the high depth-to-diameter ratio characteristic of the Bessel beam can be used to control the modification depth. According to the different numerical aperture requirements, different depths of modification can be realized. A single micro Lens fixed-point laser modification, no translation stage movement, using hydrofluoric acid solution to etch the modified sample, after etching, high-quality micro-lens processing with controllable numerical aperture can be obtained

Method used

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  • Method for processing numerical aperture variable micro lens through space shaping laser
  • Method for processing numerical aperture variable micro lens through space shaping laser
  • Method for processing numerical aperture variable micro lens through space shaping laser

Examples

Experimental program
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Embodiment 1

[0034] The invention is applicable to the processing of microlenses with controllable numerical apertures of borosilicate glass, BK-7, BK-9 and other glass materials. In this example, BK-9 glass is used as a processing sample. The specific steps of this example are as follows:

[0035] (1) Build a femtosecond laser space shaping processing system. The processing system uses a 2° cone lens to achieve spatial phase shaping and generate Bessel beams. A plano-convex lens with f=150mm and a 20x microscope objective lens are used to realize Bessel beam shrinkage. Build the processing optical path and adjust the height of the translation stage to ensure that the Bessel end is close to the upper surface of the sample.

[0036] (2) Use as attached figure 1 The processing device shown in the figure performs modification processing at different depths, mainly consisting of a femtosecond laser 1, an attenuator 2, an optical switch device 3, a mirror 4, a telescopic system 5, a dichroic...

Embodiment 2

[0041] Simultaneous processing of double-layer microlenses with variable numerical apertures is realized on glass materials. The specific steps of this example are as follows:

[0042] (1) The thickness of the transparent material sample used in the experiment is generally about 1 mm. The Bessel beam has the characteristics of a long focal depth, which can penetrate the upper and lower sides of the sample to realize simultaneous modification of the upper surface and the lower surface. Add a ring before the axicon lens The diaphragm can divide the light into two sections, and by controlling the size of the annular diaphragm, it is possible to realize synchronous control of the modification depth control of the upper and lower layers, thereby controlling the depth of the microlens.

[0043] (2) By controlling the etching time, the control of the diameter of the microlens is realized, and the double-layer microlens array is formed during the etching process, which greatly improve...

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Abstract

The invention relates to a method for machining a numerical aperture variable micro lens through space shaping laser, and belongs to the technical field of laser application. According to the method,the machining quality, the machining efficiency and the shape controllability are considered, and the numerical aperture of the micro lens can be controlled within the maximum range on the same material. According to the method, glass modification is realized by adopting a Bessel beam obtained by spatial phase shaping; by utilizing the high depth-to-diameter ratio characteristic of the Bessel beam, control over the modification depth is achieved, according to different numerical aperture requirements, modification of different depths, fixed-point laser modification of a single microlens and movement without a translation table are achieved, a hydrofluoric acid solution is used for etching a modified sample, and high-quality microlens machining with the controllable numerical aperture is obtained after etching. According to the method, the machining quality, efficiency and morphology control of the micro lens can be considered, and different requirements for numerical apertures in application of the micro lens are met.

Description

technical field [0001] The invention relates to a method for space-shaping laser-assisted etching and processing microlenses with variable numerical apertures, and belongs to the technical field of laser applications. Background technique [0002] Due to the characteristics of small size, light weight, high degree of integration, and excellent optical performance, micro-curved surfaces have broad application prospects in aerospace, optics, communications and other fields. In the aerospace field, millimeter-scale concave lenses are used in the core components of integral field microscopes. In the field of optics, the microlens array with bionic compound eye structure improves the field of view and expands the imaging range; the application of planar microlens arrays in cameras and virtual reality imaging systems reduces the space of the device and improves the integration of the device; A single microlens is applied to the detection field to realize real-time detection of th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B3/00
CPCG02B3/0025G02B3/0056
Inventor 姜澜秦斌李晓炜刘洋
Owner BEIJING INSTITUTE OF TECHNOLOGYGY