Terahertz heterogeneous integrated chip

Abstract

The invention discloses a terahertz heterogeneous integrated chip. The terahertz heterogeneous integrated chip comprises a first silicon germanide substrate, a T-shaped power synthesis circuit and twosymmetrically arranged circuits to be synthesized, the circuit to be synthesized comprises a capacitor, an inductor, a first filter and a frequency doubling diode which are sequentially connected through a microstrip line, the inductor is embedded in the first silicon germanide substrate, one bonding pad of the frequency doubling diode is connected with the input end of the T-shaped power synthesis circuit through the microstrip line, and the other bonding pad of the frequency doubling diode is grounded. According to the terahertz heterogeneous integrated chip, the substrate is the first silicon germanide substrate, is a semiconductor process substrate and is of a multi-layer stacked structure, and the inductor is embedded in the first silicon germanide substrate, so that the occupied area of the first silicon germanide substrate is effectively reduced, and the size of the terahertz heterogeneous integrated chip is reduced; besides, the first silicon germanide substrate is a semiconductor process substrate, and the microstrip line used in cooperation with the first silicon germanide substrate can be as low as several microns, so that the occupied area can also be reduced, and theintegration level of the terahertz heterogeneous integrated chip is improved.

Description

technical field [0001] The present application relates to the technical field of terahertz heterogeneous integrated circuits, in particular to a terahertz heterogeneous integrated chip. Background technique [0002] Terahertz technology is a very important cross-frontier field, which has important applications in communication, radar, astronomy, medical imaging, biochemical identification, materials science, security inspection and other fields. [0003] Terahertz waves refer to electromagnetic waves in the frequency range of 0.1-10THz, and a frequency multiplication circuit is a circuit that can realize frequency conversion in the terahertz frequency band. At present, terahertz frequency multiplication circuit chips are all based on quartz substrates. Various diodes, filters and other circuit components are laid on the upper surface of the quartz substrates, and they are completely connected by microstrip lines. Since the quartz substrate is a completely solid single-layer...

AI Technical Summary

Problems solved by technology

Since the quartz substrate is a completely solid single-layer plate-shaped substrate, various circuit components are completely arranged on the surface of the quartz substrate, which requires a larger area of ​​the quartz substrate for carrying. On the other hand, it is used in conjunction with the quartz substrate The microstrip line is relatively thick, generally more than ten microns, so the area occupied by the microstrip line is also large, resulting in a large volume of the entire substrate and low integration.

In some special occasions, when the chip size is required, the application will be limited

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