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Microchip integrated explosive foil detonator based on planar high-voltage switch

A high-voltage switch and explosive foil technology, which is applied in blasting barrels, weapon accessories, offensive equipment, etc., can solve problems that have not yet been seen, and achieve the effects of reducing ignition energy, broadening the application range, and reducing volume

Inactive Publication Date: 2020-09-29
NANJING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, so far, there has been no report on the integration of planar high-voltage switches and explosive foil initiators using microelectromechanical processing technology (Microelectromechanical system, MEMS).

Method used

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  • Microchip integrated explosive foil detonator based on planar high-voltage switch
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  • Microchip integrated explosive foil detonator based on planar high-voltage switch

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Embodiment

[0025] combine figure 1 , 2 , 3, the present embodiment has prepared a kind of microchip integrated explosive foil detonator based on planar high-voltage switch, and described chip comprises ceramic substrate 1, metal layer one 2, insulation layer 3, metal layer two 4, photoresist layer 5. Diode 6, metal welding strip 7 and explosive column 8. Using the magnetron sputtering deposition process, combined with the ultraviolet lithography technology, the metal layer 12 is prepared, and its film system is a W-Ti / Cu layer with a thickness of 50nm / 5μm, which is placed on the ceramic substrate 1, and the metal layer 12 The side of the planar high voltage switch is used as the lower electrode 2-a, and the side of the explosive foil initiator is used as the explosive foil 2-b. The size of the explosive foil is 600μm×600μm, and the other two "islands" are used as pads 1-2-c and Pad 2 2-d; Prepare an insulating layer 3 with a thickness of 50 μm by chemical vapor deposition, and place it...

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Abstract

The invention discloses a microchip integrated explosive foil detonator based on a planar high-voltage switch. The microchip integrated explosive foil detonator includes a ceramic base sheet, a metallayer I, an insulating layer, a metal layer II, a photoresist layer, a diode, a metal solder strip and an explosive column. The microchip integrated explosive foil detonator integrates the planar high-voltage switch and an explosive foil, the cost of the planar high-voltage switch is greatly reduced, and the consistency of samples is improved; the structure of a capacitor discharge unit is more compact through an integrated design, and the ignition energy is greatly reduced; and finally, the size of the device is controlled within 100 mm<3>, which conforms to the development direction of the miniaturization of explosive foil detonators, and the application range is broadened.

Description

technical field [0001] The invention belongs to the technical field of miniature low-energy insensitive ignition and detonation devices, in particular to a microchip-integrated explosive foil detonator based on a planar high-voltage switch. Background technique [0002] The Exploding Foil Initiator (EFI) is also known as the Shock Detonator, which mainly includes a metal bridge foil, a flyer layer, an accelerating chamber and an insensitive charge. Because it does not contain sensitive energetic materials, and there is no direct contact between the energy output carrier (flyer) and the main charge, it has strong anti-electromagnetic interference ability and can adapt to extreme external environments, such as static electricity, radio frequency, electromagnetic etc., is an extremely safe and reliable detonating device. [0003] The high-voltage switch is one of the key components in the detonating foil detonator, which determines the output characteristics of the detonating ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F42B3/12
CPCF42B3/12
Inventor 朱朋徐聪沈瑞琪
Owner NANJING UNIV OF SCI & TECH
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