A kind of installation structure applied to miniled and manufacturing method thereof

A technology of installation structure and production method, which is applied in the direction of assembling printed circuits with electrical components, identification devices, circuit heating devices, etc., can solve the problems of falling, unfavorable miniLED stability on the FPC substrate, etc., to prevent cracking, convenient and accurate. The effect of stable welding and accelerated heat dissipation

Active Publication Date: 2021-12-31
SHENZHEN LONGLI TECH CO LTD
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0010] The above-mentioned existing technical solutions have the following defects: since the solder paste cannot be accurately dropped in the pad, when the solder paste outside the pad is reflowed, it is easy to cause the solder paste in the pad to be affected by the tin outside the pad. The traction force of the paste prevents the reflow from being in the center of the solder pad. For this, only a small amount of solder paste solders the miniLED’s soldering feet, which is not conducive to the stability of the miniLED on the FPC substrate. When the miniLED is subjected to external forces, it is prone to drop.

Method used

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  • A kind of installation structure applied to miniled and manufacturing method thereof
  • A kind of installation structure applied to miniled and manufacturing method thereof
  • A kind of installation structure applied to miniled and manufacturing method thereof

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Embodiment Construction

[0048] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0049] like figure 1 As shown, an installation structure applied to miniLED is used for the stable installation of miniLED4 to ensure that miniLED4 will not fall easily when subjected to external force. It includes FPC substrate 1, mesh board 2 and miniLED4. It is adapted and pasted on the FPC substrate 1 by adhesive tape. The miniLED4 is welded on the FPC substrate 1 through the solder paste 3 and the mesh 2. The overall thickness of the miniLED4 is the same as the thickness of the mesh 2. When the FPC substrate 1 is energized, the miniLED4 Shine bright. In addition, when the screen plate 2, FPC substrate 1 and miniLED4 are assembled together, it can be called an integrated light source for the backlight. When it is assembled with other backlight film materials, it will form a miniLED4 backlight module assembly.

[0050] like figure 2 As shown, the FPC s...

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Abstract

The present invention relates to a mounting structure applied to mini LEDs and a manufacturing method thereof, and relates to the field of display technology, which includes an FPC substrate, the FPC substrate includes pads of the same size arranged in a matrix and lines connected to the pads. A stencil is attached to the FPC substrate, and the stencil is provided with a through hole that is compatible with the pad and allows the solder paste to fall into the pad, and the through hole is for the mini LED to snap into. . The present invention has the effect of facilitating precise and stable welding of the mini LED on the FPC substrate.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an installation structure applied to mini LEDs and a manufacturing method thereof. Background technique [0002] As a direct-lit display backlight, the sub-millimeter light-emitting diode (miniLightEmittingDiode, miniLED) has many advantages such as high brightness, high contrast, local dimming display, special-shaped bendable, and narrow frame, and has become the focus of attention. With the steady advancement of 5G commercial use, greater broadband and higher network speed will surely promote the continuous improvement and rapid growth of the ultra-high-definition video industry chain. The mini LED backlit display can achieve display effects in terms of image quality, saturation, and contrast. A new type of LED display technology derived from a small-pitch LED. The number of electronic components on the circuit board has reached tens of thousands. In order to manufacture circu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/34H05K1/02G02F1/13357G09F9/30
CPCH05K3/3421H05K3/3494H05K1/0209H05K1/0274H05K1/0281G02F1/133603G09F9/30
Inventor 涂都李兵周江华
Owner SHENZHEN LONGLI TECH CO LTD
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