PUF unit supporting environmental perception, PUF and mixed PUF
A technology of environmental perception and external environment, applied in the direction of electrical components, automatic power control, digital transmission system, etc., can solve the problem of inability to apply chip anti-counterfeiting
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[0038] Solder the chip on the PCB, and connect the corresponding PADs through the wires on the PCB. The only parasitic RC will be brought by the PAD pin, solder and pad during the soldering process, and the only parasitic RC will be brought by the PCB during the manufacturing process. At this time, the only delay caused by soldering and PCB exists in the off-chip circuit. The output of PUF is obtained by comparing between ROs. The impact of ambient temperature and other noise on all off-chip circuits is the same, so these effects will be eliminated in the comparison, and finally only those related to soldering and PCB boards remain. Delayed participation in the comparison. Therefore, the obtained PUF result will be related to the environment of the current chip (the environment formed by the delay caused by soldering parasitic RC and the delay of the PCB line). If the chip is disassembled and replaced to other places, the welding environment and the delay of the PCB line hav...
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