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Resin composition, prepreg comprising same, laminated plate comprising same, and resin-coated metal foil comprising same

A technology of resin composition and coating layer, applied in the field of metal foil, which can solve the problems of low filler dispersion, high melt viscosity, and difficult molding processability

Active Publication Date: 2020-10-20
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Conventionally, in order to develop such insulating materials, insulating materials based on polyphenylene ether (PPE) resins, which are thermosetting resins having excellent dielectric properties, have been developed, but they have high melt viscosity, the possibility of prepregs Problems such as operability and molding workability are difficult
In addition, fillers such as porous fillers that contribute to low dielectric properties are introduced into polyphenylene ether resins, but the dispersibility of the fillers is low, which causes problems in processability and heat resistance, and there are difficulties in applying the fillers at a high content The problem

Method used

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  • Resin composition, prepreg comprising same, laminated plate comprising same, and resin-coated metal foil comprising same
  • Resin composition, prepreg comprising same, laminated plate comprising same, and resin-coated metal foil comprising same

Examples

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Embodiment 1 to 4 and comparative example 1 to 4

[0084] The binder resin, the inorganic filler, and the organic-inorganic composite filler were mixed according to the compositions shown in Table 1 below, and stirred for 4 hours to prepare resin compositions of Examples and Comparative Examples.

[0085] [Table 1]

[0086]

[0087] - Polyphenylene ether: OPE-2st-1200, available from MGC (Mitsubishi Gas Chemical Company, Inc.)

[0088] - Bismaleimide resin: BMI-5100 available from DAIWA Kasei

[0089] - Cyanate resin: ULL-950S available from Lonza Ltd.

[0090] - Styrene-butadiene rubber: Ricon181 available from Cray Valley

[0091] - Inorganic filler: Vinylsilane (vinyltrimethoxysilane) surface treated slurry type (70% solids) filler (silica) with an average particle size of 0.5 μm, SC2050, available from Admatechs

[0092] -Organic-inorganic composite filler: PTFE** coated with silica*, average particle size 3μm, specific surface area 1.5m 2 / g, available from Admatechs

[0093] *Silica: Vinylsilane (vinyltrimethoxys...

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Abstract

The present invention relates to a resin composition comprising a binder resin and an organic-inorganic composite filler, a prepreg comprising same, a laminated plate comprising the same, and a resin-coated metal foil comprising the same.

Description

technical field [0001] Cross References to Related Applications [0002] This application claims the benefit of the filing date of Korean Patent Application No. 10-2018-0146306 filed with the Korean Intellectual Property Office on November 23, 2018, the entire disclosure of which is incorporated herein by reference. [0003] The present invention relates to a resin compound, a prepreg comprising the same, a laminate comprising the same, and a resin-coated metal foil comprising the same. Background technique [0004] Recently, signal bands of electronic parts such as semiconductor substrates, printed circuit boards, and epoxy molding compounds (EMC, epoxy molding compounds), and information and communication equipment tend to increase. The transmission loss of an electrical signal is proportional to the dielectric loss tangent and frequency. Therefore, a higher frequency increases transmission loss and causes signal attenuation, thereby deteriorating the reliability of sig...

Claims

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Application Information

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IPC IPC(8): C08K9/06C08K3/013C08J5/24C08J5/06B32B37/10B32B38/00B32B5/26B32B15/08B32B27/20
CPCB32B37/10B32B38/00C08K9/06C08L71/123C08J2379/04C08J2471/12C08J2479/08C08J2409/06C08J3/128C08J2427/18B32B2457/14B32B2255/02B32B2457/08B32B5/26B32B2260/023B32B2262/106B32B2255/26B32B2307/732B32B2262/0276B32B2307/204B32B2262/0269B32B15/20B32B15/14B32B5/022B32B2260/046B32B2262/101B32B15/12B32B2255/12B32B2307/306C08L2207/53C08L61/14C08L79/04C08J5/244C08J5/249C08K3/36C08L9/06C08L27/18C08L79/085C08K3/013C08J5/06B32B38/0036B32B15/08B32B27/20B32B2305/076B32B2260/021B32B2264/12C08J5/24B32B5/10C08J2309/06C08J2367/00C08J2371/12C08L67/00C08L71/12C08L79/08
Inventor 黄勇善沈昌补闵铉盛朴惠林
Owner LG CHEM LTD
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