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High-temperature ceramic plate type array capacitor and preparation method thereof

A technology of high-temperature ceramics and capacitors, which is applied in the field of capacitors and can solve problems such as easy damage, reduced reliability of filters, and weak mechanical shock capabilities

Pending Publication Date: 2020-10-23
北京七星飞行电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] To this end, the present invention provides a high-temperature ceramic plate array capacitor and its preparation method to solve the problem that the discrete ceramic tubular capacitor filter in the prior art has weak ability to withstand mechanical shock, is easy to be damaged, and easily causes the reliability of the entire filter. problem of reduced sex

Method used

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  • High-temperature ceramic plate type array capacitor and preparation method thereof
  • High-temperature ceramic plate type array capacitor and preparation method thereof
  • High-temperature ceramic plate type array capacitor and preparation method thereof

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Embodiment

[0030] refer to Figure 1-3 , this embodiment discloses a high-temperature ceramic plate array capacitor, the capacitor body includes: ceramic dielectric 1, internal electrodes and terminal electrodes, the capacitor body is a multi-layer plate structure with a plurality of signal holes, and the internal electrodes include : multiple common ground electrodes and multiple signal electrodes, multiple common ground electrodes and multiple signal electrodes are arranged alternately in the lamination direction of the ceramic medium, and the projection parts of the common ground electrodes and signal electrodes on the lamination plane overlap; each A common ground electrode extends inward from the outer edge of the ceramic dielectric 1 and keeps a distance from the signal hole; each signal pole extends outward from the signal hole and keeps a distance from the outer edge of the capacitor and the signal pole of the adjacent signal hole, Keep a certain distance between adjacent signal ...

Embodiment 2

[0033] This embodiment discloses a method for preparing a high-temperature ceramic plate array capacitor, the method is as follows:

[0034] S1, preparing a green body by wet printing;

[0035] S2. Machining the green body so that the shape of the green body is the same as that of the plate array capacitor and has a certain ratio to the size of the green body;

[0036] S3, debinding and sintering the green body to prepare a ceramic medium 1;

[0037] S4. Prepare the common ground electrode terminal 2, the signal electrode terminal 3, and the surface coating layer on the ceramic medium 1 to complete the preparation of the high-temperature ceramic plate array capacitor.

[0038] The method for preparing the green body by wet printing in step S1 is: preparing a ceramic medium slurry, which is a slurry made by mixing ceramic powder and an organic binder. The organic binder is dissolved in an organic polymer Uniform viscous liquid obtained in an organic solvent; the organic polym...

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Abstract

The invention discloses a high-temperature ceramic plate type array capacitor and a preparation method thereof. The capacitor main body includes: a ceramic medium, an inner electrode and a terminal electrode, the capacitor main body is of a multilayer plate-shaped structure with a plurality of signal holes, the inner electrode comprises a plurality of common grounding electrodes and a plurality ofsignal electrodes, the plurality of common grounding electrodes and the plurality of signal electrodes are alternately arranged in the lamination direction of the ceramic medium, and the projectionsof the common grounding electrodes and the signal electrodes on a lamination plane are partially overlapped; each common grounding electrode extends inwards from the outer edge of the ceramic medium and is spaced from the signal hole; and each signal electrode extends outwards from the signal hole and is spaced from the outer edge of the capacitor and the signal electrode of the adjacent signal hole. The problems that in the prior art, a discrete ceramic tube type capacitor filter is poor in mechanical shock resistance and prone to damage, and the reliability of the whole filter is prone to being reduced are solved.

Description

technical field [0001] The embodiments of the present invention relate to the technical field of capacitors, in particular to a high-temperature ceramic plate array capacitor and a preparation method thereof. Background technique [0002] With the development of electronic equipment towards high frequency, high speed, high sensitivity, high reliability, multi-function, miniaturization and informatization, electrical connectors also develop towards miniaturization, high density, high frequency and multi-function. The need for equipment to combat electromagnetic interference is growing rapidly. There are two main ways to resist electromagnetic interference: shielding and filtering. Most traditional filter connectors use tube capacitors for filtering. Tubular capacitors are characterized by large size, low capacitance, poor mechanical strength, and low reliability. Since the tubular capacitor is a single-layer ceramic structure, the thickness of the ceramic tube is generally...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/005H01G4/232H01G4/30H01G4/224H01G4/12C04B41/89
CPCC04B41/009C04B41/52C04B41/89H01G4/012H01G4/12H01G4/224H01G4/232H01G4/30C04B41/5022C04B41/46C04B41/48C04B35/00
Inventor 贾桂荣颜祥峰刘刚
Owner 北京七星飞行电子有限公司
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