Method for improving coupling performance of multi-antenna system by adopting heat dissipation hole structure

Abstract

The invention discloses a method for improving coupling performance of a multi-antenna system by adopting a heat dissipation hole structure. Each antenna unit of the multi-antenna system is respectively arranged at different positions on a dielectric substrate. The method comprises the following steps of: arranging a plurality of the heat dissipation hole structures in special shapes on the dielectric substrate, and forming heat dissipation holes among the antenna units to improve the coupling performance of the antennas. Under the conditions that the physical space is limited and strong mutual coupling exists between the adjacent antenna units, the coupling performance between the array antenna units is improved by adopting the heat dissipation hole structures in special shapes, the isolation degree between the units is improved, and the temperature of each element is reduced. By adjusting the distance, the size, the number and the shape between the heat dissipation holes and the distance between the structures and the antennas, coupling between the units of the antenna system composed of the multiple antenna units with the heat dissipation hole structures is reduced, the isolation degree is improved, the gain of the antenna array is improved, and the radiation efficiency is improved.

Description

technical field [0001] The invention relates to the field of wireless communication, in particular to a cooling hole structure for reducing the coupling of an antenna system composed of multiple antenna units, improving the isolation between antenna units, and reducing the temperature of each element in a wireless device. Background technique [0002] With the continuous development of society, people's demand for communication is increasing. In the application scenarios of the fifth generation mobile communication system (5G), the data transmission rate and the number of devices connected to the network have increased significantly. This makes spectrum resources more precious. In this context, the multiple-input multiple-output (MIMO) technology widely used in 4G has gradually become one of the important technologies of 5G. [0003] The multiple-input multiple-output (MIMO) technology refers to the use of multiple antennas at the transmitting end and the receiving end to s...

AI Technical Summary

Problems solved by technology

[0006] (2) Decrease in radiation efficiency;

[0007] (3) Decrease in unit gain;

[0008] (4) Deterioration of signal-to-noise ratio;

[0009] (5) Reduction of channel capacity

On the other hand, the number of components on the system motherboard is constantly increasing. If the heat generated by these components cannot be dissipated quickly, it will not only affect the working effect of the components, but also burn the components and cause the equipment to be paralyzed.

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