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Brittle and hard material cutting method and device

A cutting method and cutting device technology, applied in the direction of grinding drive devices, fine working devices, stone processing equipment, etc., can solve the problems of low processing efficiency of brittle and hard materials, achieve flexible and efficient cutting, compact structure, and improve cutting efficiency. efficiency effect

Pending Publication Date: 2020-10-27
福州天瑞线锯科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] For this reason, it is necessary to provide a cutting method for brittle and hard materials, which is used to solve the technical problem of low processing efficiency of brittle and hard materials in the prior art

Method used

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  • Brittle and hard material cutting method and device
  • Brittle and hard material cutting method and device
  • Brittle and hard material cutting method and device

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Embodiment Construction

[0059] In order to explain in detail the technical content, structural features, achieved goals and effects of the technical solution, the following will be described in detail in conjunction with specific embodiments and accompanying drawings.

[0060] see Figure 1 to Figure 10 , this embodiment provides a method and device for cutting brittle and hard materials. Wherein, the brittle and hard material includes but not limited to one or more of stone, silicon crystal material, concrete, and glass. The cutting method includes, but is not limited to, cutting using the first cutting line 11 and the second cutting line 12, wherein the first cutting line 11 and the second cutting line 12 can be diamond wires, or can be shaped cutting wires made of other high-hardness materials. . According to different brittle and hard materials to be cut, the diameters of the first cutting line 11 and the second cutting line 12 are 0.1-1.0 mm. In the cutting method, the brittle material is cut...

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Abstract

The invention relates to the field of brittle and hard material machining, and discloses a brittle and hard material cutting method and device. The method comprises the steps that a brittle and hard material is fixed; two or more cutting wires parallel to each other are arranged on a cutting mechanism, and the cutting mechanism is adjusted, so that a plane where the cutting wires are located is parallel to a cutting feeding direction, or the cutting wires are spaced by a preset distance along a projection plane of the cutting feeding direction; and the brittle and hard material is cut, and during cutting, the two or more cutting wires are located in the same cutting groove in the brittle and hard material, or each of the cutting wires is located in a corresponding different cutting grooveof the brittle and hard material. According to the technical scheme, the brittle and hard material can be flexibly and efficiently cut, single-wire cutting can be carried out, and multi-wire simultaneous cutting can also be carried out, so that the cutting efficiency of the brittle and hard material is greatly improved.

Description

technical field [0001] The invention relates to the field of brittle and hard material processing, in particular to a cutting method and device for brittle and hard materials. Background technique [0002] At present, diamond wire is mainly used to cut and cut brittle and hard materials such as stone and silicon crystal. The wire saw is equipped with a plurality of cutting guide wheels to form a cutting wheel train. The diamond wire is a closed circular cutting wire structure. The diamond wire is laid in the guide wheel groove of the cutting wheel train. sports. The cutting action is generally only carried out in the lower half of the diamond wire. The middle part of the wheel train is a window to avoid interference between the wheel train and the ingot. The cutting wheel train is usually driven by a linear motion module installed on the frame. Give, thereby achieving cutting. [0003] In the patent whose application number is CN201780048352.6, a method for cutting a sili...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/04B28D1/06B28D7/00B24B27/06B24B47/20
CPCB24B27/0633B24B47/20B28D1/06B28D5/0058B28D5/0064B28D5/045B28D7/00B28D7/005
Inventor 李海威林冬梁兴华吴超林光展刘林炎苏宇华林剑煌林桂峰
Owner 福州天瑞线锯科技有限公司
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