Manufacturing method for 3D printing workpiece with high interfacial heat conductivity

Abstract

The invention provides a manufacturing method for a 3D printing workpiece with high interfacial heat conductivity. The manufacturing method utilizes a mechanochemistry reactor disclosed in the Chineseauthorized patent for invention ZL 9511285.9 to perform grinding, crushing and mixing on straight polymer particles and heat conduction carbon-based filler on the condition of controlling grinding disc surface temperature, grinding disc pressure and circular grinding frequency; then strands for 3D printing are manufactured through extruding and moulding; and finally the 3D printing workpiece withhigh interfacial heat conductivity is obtained through fused deposition moulding 3D printing. The 3D printing workpiece can be manufactured through a fused deposition moulding 3D printing technique on the basis of high interfacial heat conductivity; and the manufacturing method has the features of being simple in technique and suitable for continuous production, and is applicable to industrial production of heat conduction workpieces with complex structures.

Description

technical field [0001] The invention belongs to the technical field of 3D printed parts with interplane thermal conductivity, and specifically relates to a method for preparing 3D printed parts with high interfacial thermal conductivity, especially for the mechanochemical method disclosed in Chinese authorized invention patent ZL 95111258.9. The reactor carries out the preparation of the printing filaments used in the above-mentioned 3D printing parts. Background technique [0002] With the development of modern industry, the microelectronics industry is an important part of it. Electronic devices are becoming increasingly high-speed, integrated, and high-density. They will inevitably generate a lot of heat under working conditions, and electronic devices must be prevented from overheating through heat dissipation. The main purpose of heat dissipation design is to dissipate the heat generated by electronic devices through heat conduction. [0003] General-purpose thermally ...

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Problems solved by technology

However, due to the early completion of the paper (2002), no further in-depth discussion and research on the interfacial thermal resistance between the functional filler and the polymer matrix, nor whether it can be used to prepare filaments suitable for FDM 3D printing At the same time, as shown above, the thermal conductivity of the composite material prepared by the final solid phase shear milling is not high only 0.748W / mK, under the same ratio (graphite content is 30wt.% in the PP / YEP35 system), traditional The thermal conductivity of composites prepared by the direct melt blending process is usually about 0.643W / mK, so the thermal conductivity of the former is limited compared to the latter

[0008] Therefore, the existing technology can only be limited to the use of compression molding technology for polymer-based thermally conductive materials that meet industrial standards. The processed products have a simple structure, cannot be continuously produced, and have a long production cycle. It is impossible to give the product a complex porous structure to meet the ventilation of heat conduction; at the same time, due to the constraints of the technology itself during the molding process, defects are easily generated inside the plate product, which affects its performance; mainly, it is fundamentally impossible to obtain high thermal conductivity between the surfaces. Parts, which limit the application range of heat-conducting parts

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