A method for preparing 3D printed parts with high interplane thermal conductivity

Abstract

The present invention provides a method for preparing 3D printed parts with high thermal conductivity between surfaces. The preparation method uses the mechanochemical reactor disclosed in the Chinese authorized invention patent ZL 95111258.9 to control pure polymer particles and carbon fillers for heat conduction. Grinding, pulverizing and mixing under the conditions of disc surface temperature, disc pressure and cycle grinding times, then extruding to obtain filaments for 3D printing, and finally preparing 3D printing with high inter-surface thermal conductivity by fused deposition modeling 3D printing parts. The 3D printed product can be prepared by fused deposition modeling 3D printing technology on the basis of high inter-surface thermal conductivity; the preparation method has the characteristics of simple process and continuous production, and is suitable for industrial production of complex structure thermal conductive parts.

Description

technical field [0001] The invention belongs to the technical field of 3D printed parts with interplane thermal conductivity, and specifically relates to a method for preparing 3D printed parts with high interfacial thermal conductivity, especially for the mechanochemical method disclosed in Chinese authorized invention patent ZL 95111258.9. The reactor carries out the preparation of the printing filaments used in the above-mentioned 3D printing parts. Background technique [0002] With the development of modern industry, the microelectronics industry is an important part of it. Electronic devices are becoming increasingly high-speed, integrated, and high-density. They will inevitably generate a lot of heat under working conditions, and electronic devices must be prevented from overheating through heat dissipation. The main purpose of heat dissipation design is to dissipate the heat generated by electronic devices through heat conduction. [0003] General-purpose thermally ...

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Problems solved by technology

However, due to the early completion of the paper (2002), no further in-depth discussion and research on the interfacial thermal resistance between the functional filler and the polymer matrix, nor whether it can be used to prepare filaments suitable for FDM 3D printing At the same time, as shown above, the thermal conductivity of the composite material prepared by the final solid phase shear milling is not high only 0.748W / mK, under the same ratio (graphite content is 30wt.% in the PP / YEP35 system), traditional The thermal conductivity of composites prepared by the direct melt blending process is usually about 0.643W / mK, so the thermal conductivity of the former is limited compared to the latter

[0008] Therefore, the existing technology can only be limited to the use of compression molding technology for polymer-based thermally conductive materials that meet industrial standards. The processed products have a simple structure, cannot be continuously produced, and have a long production cycle. It is impossible to give the product a complex porous structure to meet the ventilation of heat conduction; at the same time, due to the constraints of the technology itself during the molding process, defects are easily generated inside the plate product, which affects its performance; mainly, it is fundamentally impossible to obtain high thermal conductivity between the surfaces. Parts, which limit the application range of heat-conducting parts

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