Packaging method of vacuum light sensation bonding microfluidic biochip
A technology of biochips and packaging methods, applied in chemical instruments and methods, laboratory containers, laboratory utensils, etc., can solve problems such as deformation of microfluidic pipelines, overflow of colloids into structural areas, and destruction of microfluidic structures. Achieve fast bonding speed, improve product yield, and speed up the effect of bonding
Inactive Publication Date: 2020-11-13
杭州欧光芯科技有限公司
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Problems solved by technology
[0005] The present invention aims to solve the above existing microfluidic biochips existing in the bonding and packaging technology, such as serious deformation of the microfluidic pipeline or damage to the microfluidic structure, as well as defects such as colloid overflowing into the structural area during the bonding process, etc. Provide a packaging method for vacuum photosensitive bonding microfluidic biochips, avoiding the packaging defects in the above-mentioned commonly used bonding processes
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[0029] In order to make the technical solution of the present invention clearer, preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0030] Such as figure 1 As shown, the quartz substrate 1, the quartz cover plate 2, the substrate bonding groove 11, the cover plate bonding groove 21, the first flow guide air hole 22, the second flow guide air hole 23 and the microfluidic structure region 4; An annular substrate bonding groove 11 is formed on the edge of the top surface of the base 1, and an annular cover bonding groove 21 is formed on the edge of the bottom surface of the quartz cover plate 2. The base bonding groove 11 and the cover bonding groove 21 are aligned up and down, and the cover plate The bonding groove 21 and the base bonding groove 11 are rectangular annular grooves; the top surface of the quartz cover plate 2 is provided with two flow guiding holes 22 and 23, the first guiding hole The...
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The invention discloses a packaging method of a vacuum light sensation bonding microfluidic biochip. Annular bonding grooves are formed in the edge of the top surface of a quartz substrate with a microfluidic structure and the edge of the bottom surface of a quartz cover plate respectively, two flow guide and air guide holes are formed in the top surface of the quartz cover plate, and the lower ends of the flow guide and air guide holes communicate with a cover plate bonding groove; the quartz substrate and the quartz plate cover plate are vertically aligned and attached, the cover plate bonding groove and a substrate bonding groove are communicated to form a bonding channel, and a gap between middle areas is defined by the quartz substrate and the cover plate bonding groove to form a micro-fluidic structure area; air in the bonding channel is exhausted from one flow guide and air guide hole under vacuum negative pressure, an ultraviolet curing adhesive enters the bonding channel fromthe other flow guide and air guide hole and fills the bonding channel, and the quartz plate cover plate and the quartz substrate are bonded through ultraviolet exposure curing. The bonding defects that bubbles are generated due to high pressure and high temperature, colloid overflows to a structure area, and a substrate is damaged in the thermocompression bonding packaging process can be overcome,and rapid packaging of the microfluidic biochip is achieved.
Description
technical field [0001] The invention relates to a packaging process method in the manufacturing process of a microfluidic biochip, in particular to a packaging method for a vacuum photosensitive bonding microfluidic biochip, which is used to improve the packaging speed and quality of the microfluidic biochip. Background technique [0002] In recent years, with the rapid development of electronic technology (semiconductor technology) and biotechnology, microfluidic biochips have the advantages of convenience, speed, mass and low cost, and they are widely used in gene detection, drug screening, disease diagnosis and prevention. Tons of applications. Firstly, micro-nano-level structures or channels are prepared on the substrate through micro-processing methods, such as semiconductor technology and nano-imprint technology, and then combined with biological analysis technology to achieve specific detection purposes. [0003] The bonding process is one of the key technologies in ...
Claims
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IPC IPC(8): B01L3/00
CPCB01L3/502707
Inventor 张琬皎龙眈
Owner 杭州欧光芯科技有限公司